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18. März - 21. März
Fountain Hills, AZ, USA
United States of America
English

IMAPS DPC 2024

The 20th Annual Device Packaging Conference (DPC 2024) is an event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). It is a premier event this spring for the microelectronics assembly advanced packaging, that will bring together distinguished industry engineers, researchers, and experts while showcasing the latest developments in photonics and microelectronics. Booth: #55