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Automotive LIDAR Conference and Exhibition 2019

10 SEPT. 2019
21:00
NACHRICHT
DIE BONDING SOLUTIONS

MRSI Systems is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2019 Conference and Exhibition in Detroit, Michigan from September 25-26th, 2019. MRSI Systems is presenting on Thursday, September 26th. See the conference agenda for more details. Visit MRSI at Table #22 to discuss your assembly requirements.

The main focus of last year’s Conference was on hardware and software solutions. The use of AI (Artificial Intelligence) and machine learning provides an instrument to integrate the many sensing technologies such as LIDAR, RADAR, and Machine Vision. Predictive modeling is used to teach the system as a whole. By integrating data from all of the sensors, a more complete “picture” develops. The more scenarios presented to the system, the better the system becomes.

This year’s Conference will include LIDAR focused workshops, and presentations on the following topics:

  • Fabrication, packaging, and system assembly techniques
  • Impacts of enabling technologies such as artificial intelligence
  • LIDAR data fusion with other types of sensors such as radar and camera
  • Notable academic research related to LIDAR for automotive applications
  • Supply chain trends and challenges
  • State-of-the-art LIDAR technologies

MRSI’s Solutions for LIDAR Applications

MRSI packages the core laser engine parts for LIDAR. Whether the laser engine is based upon large VCSEL array or high-power edge emitting lasers, MRSI provides the best-in-class solutions. Techniques include high placement precision, co-planarity assembly, bonder line thickness control, and delicate force control for fragile III-V laser materials (for R&D and volume production). The lasers can be bonded to all type of carrier materials such as ceramic, metal, and printed circuit board. They use eutectic reflow bonding, thermal epoxy stamping or dispensing, and in-situ UV curing. Our engineering and field applications teams are highly experienced with advanced packaging processes. They will ensure the systems are properly supported for your specific application requirements.

Contact us with your requirements today or to schedule a meeting at the conference.