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25 APR. 2017, 21:00
NACHRICHT
DIE BONDING SOLUTIONS

The International Microelectronics Assembly and Packaging Society New England Chapter’s Symposium will be held in Boxborough, MA on May 2nd, 2017. The keynote address – “From Interconnect to Innovation in the DoD” will be presented by Dr. Livia Racz from MIT Lincoln Laboratory.

MRSI Systems is a GOLD sponsor of the iMAPS NE Symposium. Dr. Yi Qian, VP of Product Management, MRSI Systems is chairing a technical session “Nanoelectronics and Optoelectronics.” Presenting papers are tenured professors from MIT and UMass, and Peter Cronin, Director of Applications and Service, MRSI Systems.

Other technical sessions include: MEMS, RF & Microwave Innovations, Emerging Technologies, Medical Device Packaging, Thermal Management, and Printed Electronics. For more information: iMAPS New England

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By submitting this form, you are consenting to receive marketing emails from: MRSI Mycronic, 554 Clark Road, Tewksbury, MA, 01876, US. You can revoke your consent to receive emails at any time by using the Safe Unsubscribe® link, found at the bottom of every email. Emails are serviced by Constant Contact. 

Submitting means that you consent to having your personal data processed in accordance with the privacy policy