MRSI-705HF 5 micron high force die bonder won the award for “Infostone 2023 Optical Communication Most Competitive Equipment”
On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First Suzhou Optoelectronic Technology Industry Forum. There were six awards presented: “The Most Competitive Product of Optical Communication,” “The Most Competitive Equipment of Optical Communication,” “Excellent Technology Award,” “Excellent Quality Award,” “Innovation Breakthrough Award” and “Excellent Equipment Award.”
MRSI (Mycronic Group) has received the Infostone Annual Award for five consecutive years. The judges of the 10th ICC Infostone Heroes List selected only three equipment from many participating products and assessed them as the most competitive optical communication equipment in 2023, and recognized the excellent performance of this equipment in terms of R&D investment, shipments, customer feedback, and market recognition.
Equipped with a heated bond head, the MRSI-705HF 5 micron high force die bonder can apply up to 500N of force during the bonding process. It is an ideal solution for advanced applications such as sintering for power semiconductors and thermocompression bonding for IC packaging. Sintering is a heat-treatment process that gives greater strength, integrity, and conductivity to the bond and is considered the most reliable technology for connecting components in power electronics. Thermocompression bonding is a technique that uses high temperature and pressure to create strong and reliable interconnections between dies and substrates.
Dr. Irving Wang, Director of Marketing, MRSI Systems, said, “We are proud to announce the new MRSI-705HF High Force Die Bonder as part of our ongoing innovation and efforts to help our customers meet changing market demands. It will enable us to better serve our customers in the power devices and advanced chip packaging industries.”