Optimizing Die Bonding with Planarity Control: Ensuring Precision in Device Attachment Across Industries
Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces. Planarity control emerges as a vital tool in ensuring such accuracy.
The challenges in maintaining co-planarity during bonding can stem from various factors, including the size of the die, its aspect ratio, or the wedge effect along its thickness or carrier. However, MRSIs’ technology stands out for its readiness and proven track record in compensating for these conditions, facilitating optimal device attachment, whether for electrical interconnects or optical paths.
Our die bonding solutions have programmable bond-line thickness (place to a height) and place-to-force capabilities: these features enhance their versatility, accommodating various placement needs efficiently.
Innovatively designed, die bonding with co-planarity adjustment caters to a diverse range of applications, serving needs in Optical Communications, Industrial Lasers, LiDAR, Aerospace, Medical fields, and beyond.