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12 FEB. 2019, 16:30
NACHRICHT
DIE BONDING SOLUTIONS

Visit MRSI Systems at the Optical Fiber Conference in San Diego

The Optical Fiber Conference (OFC) will be held at the San Diego Conference Center in San Diego, CA, USA from March 3-7, 2019. The exhibition is from March 5-7. Visit the MRSI Systems’ Booth #4541 at OFC 2019. OFC is the largest global conference and exposition for optical communications. Contact MRSI Systems to schedule a meeting.

Conference topics include:

  • Data Centers
  • Optical Wireless Systems
  • 400G Optics for Hyperscale Data Centers
  • Challenges 5G brings to Optical Fiber Communications Systems
  • 5G Photonic Systems

Read the OFC Brochure for more details on the conference.

Enjoy a free “Exhibits Plus Pass” compliments of MRSI Systems.

MRSI’s “One Stop Shop” Die Bonding Solutions

Stop by the MRSI booth to learn more about MRSI’s “One Stop Shop” solutions which help our customers to enable just-in-time supply and fast-pace innovations of critical photonic components for high growth market segments, such as hyper-scale data centers, photonic sensors, and 5G wireless. Our die bonders are historically regarded the leaders in flexibility and we have expanded our solutions with additional configurations.

Customers appreciate the value our family of products brings across the volume spectrum whilst maintaining precision and reliability. The ultra-flexible MRSI-705 and MRSI-M3 solves the requirements of research and development teams for prototyping and demands for low/medium volume production runs. Our ultra-fast MRSI-HVM3 and MRSI-H3 offer an attractive solution to meet high volume requirements for all key die bonding applications in photonic production lines, delivering the flexibility essential in a multi-die, multi-process and multi-product environment.

Learn more about MRSI’s die bonding and epoxy dispensing solutions.

MRSI Systems is sponsoring these events during OFC 2019:

OSA Industry Development Associates (OIDA) Executive Forum

March 4th

An Exclusive Event for Business Leaders in Networking and Communications Technology. Held every year in conjunction with OFC, the OIDA Executive Forum features C-level panelists in an informal, uncensored setting, discussing the latest issues facing companies in the business. Join more than 200 senior-level executives as they convene to discuss key themes, opportunities, and challenges facing the next generation in optical networking and communications. Highly valued by participants for the frank and open discussions, OIDA Executive Forum sessions explore emerging trends and action plans for tackling today’s toughest business challenges.

Photonics Society of Chinese-Americans (PSC) OFC Workshop & Networking Event

March 6th

To serve our mission of bringing together photonics professionals, enhancing the communication and collaboration in the optical industry, PSC has been organizing technical and social events during OFC over the past 11 years. At OFC 2019, the panel of the PSC annual event consists of well-respected experts from service providers, network carriers and OEMs in the optical industry. The agenda will include the latest AI, 5G applications, autonomous vehicles, sensors, and IoT technologies and the discussion will cover market opportunities and the challenges and the business opportunities across world markets including the US and China.

Schedule a meeting with MRSI at OFC.

About MRSI Systems

MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products.  With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on- carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com.