MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet in Silicon Valley for Fast Prototyping and New Product Introduction

Advanced optoelectronic and microelectronic component and module products are experiencing record volumes driven by the rapid growth in cloud computing, data transfer and storage, and the adoption of the internet-of-things. This high volume and high growth trend has challenged component and module providers to produce prototypes quickly during product development and subsequently to scale to high volume manufacturing, fast and risk free. To respond to these challenges, Fabrinet is setting up an advanced optical packaging center in its facility in Santa Clara to provide fast prototyping and process development capability for customers of both Fabrinet and MRSI Systems. This application center, equipped with the MRSI-M3 die bonder along with many other capabilities, such as active optical alignment, wire bond, epoxy underfill, laser dicing, and various metrology tools, will further assist our customers in advanced product development and fast ramping to volume manufacturing. Fabrinet and MRSI Systems have agreed to form a partnership to provide the best support to customers on the West Coast, with both easy access to a state-of-the-art packaging facility and the ability to accelerate new product development and risk-free scaling to volume production.

MRSI-M3 delivers an industry-leading combination of accuracy, speed and reliability for complex eutectic bonding with scrubbing and/or force, integrated epoxy dispensing and stamping, thermal and UV epoxy bonding, and flip chip bonding. It provides the best flexibility in the industry handling multiple die sizes and carrier geometries for complex multi-die packaging or fabrication of multiple products. The system’s real-time closed-loop force control enables placement of delicate components either mechanically fragile or structurally complex for photonics, RF and microwave, sensor, MEMS and other applications. Die can be picked from waffle pack, Gel-Pak™, wafer, and tape and reel. The MRSI-M3 can be configured for flexible applications during prototyping or more dedicated processes during volume manufacturing.

“MRSI Systems has been serving optoelectronic and microelectronic customers for the past thirty-two years. Fabrinet is the industry leader in contract manufacturing for advanced packaging of complex products and has been a great customer to us. Both companies also serve the same customer base and market segments,” said Mr. Michael Chalsen, President of MRSI Systems. “We are very pleased to partner with Fabrinet in creating an application center in Silicon Valley to help our customers accelerate advanced product development and risk-free scaling to volume manufacturing.”

“Fabrinet is very pleased to partner with MRSI Systems to support our shared customer base in our new Fabrinet West facility located at the heart of the Silicon Valley. MRSI Systems is the industry leader in providing equipment and solutions for one of the most critical processes in advanced packaging – ultra-precision and high speed die bonding,” said Dr. Hong Hou, Executive Vice President and Chief Technology Officer of Fabrinet. “Fabrinet and its customers have been working with MRSI Systems for many years because of their product’s performance, reliability, and field service, particularly their platform design in meeting unique needs from prototyping to high volume manufacturing. We are looking forward to further our collaboration in this application center with their advanced equipment and expertise to serve our customers.”

About MRSI Systems

MRSI Systems is a leading manufacturer of fully automated, ultra-precision die bonding and epoxy dispensing systems. We enable customers to optimize the performance of their process including yield, throughput and uptime by building systems that use our unique expertise. In summary this includes, our proprietary software, proven hardware, deep process knowledge, state-of-the-art manufacturing and a world-class customer service team. MRSI’s systems are built on common platforms that can be configured to meet specific customer requirements. These platforms are designed to be scalable from prototype to volume manufacturing. Our solutions deliver the best financial returns in the industry, while integrating seamlessly into our customer’s production. Markets include Telecom/Datacom, Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial. Since 1984, we have been recognized as the standard of the industry, delivering our solutions to leading optoelectronic and microelectronic customers worldwide. Our headquarters is located in Billerica, MA in the greater Boston area. Our sales are supported by a global network of direct service and support professionals located in China, Taiwan, Singapore, Korea, Malaysia, the Philippines, Israel, the Netherlands, Switzerland, and the United States. For more information visit: www.mrsisystems.com.

MRSI Systems Media Contact
Yi Qian +1 (978) 667-9449
yi.qian@mrsisystems.com

About Fabrinet

Fabrinet is a leading provider of advanced optical packaging and precision optical, electro-mechanical, and electronic manufacturing services to original equipment manufacturers of complex products, such as optical communication components, modules and subsystems, industrial lasers and sensors. Fabrinet offers a broad range of advanced optical and electro-mechanical capabilities across the entire manufacturing process, including process design and engineering, supply chain management, manufacturing, advanced packaging, integration, final assembly and test. Fabrinet focuses on production of high complexity products in any mix and volume. Fabrinet maintains engineering and manufacturing resources and facilities in Thailand, the United States of America, and the People’s Republic of China.

For more information visit: www.fabrinet.com.

Fabrinet Media Contact
Colin R. Campbell, +1 (925) 381-5370
colinc@fabrinet.com