MRSI Systems – IEEE Tech Insider Webinar: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications
These requirements have posed significant challenges to photonic device manufacturing. To support data center build-up, the photonic device companies need to maintain an “elastic capacity model” to respond fast to data center customer’s demands, and at the same time to maintain low manufacturing costs to produce profits. This calls for much higher levels of manufacturing automation than the photonic industry has ever experienced. In addition, the co-existence of many product standards requires that manufacturing automation is flexible to allow multiple products, e.g., single die Fabry-Perot (FP) laser submount and multiple die electro-absorption laser (EML) submount assembly, to go through the same production lines without sacrificing throughput. Furthermore, more and more advanced technologies demand higher and higher precision in assembly automations, again without sacrificing speed and throughput. High speed, high precision, and high flexibility for the high volume manufacturing of photonic devices require closer collaboration than ever between device designers, process developers, manufacturing engineers, and automation equipment suppliers. This webinar will discuss these trends, challenges, and opportunities.
Speaker: Dr. Yi Qian, Vice President of Product Management, MRSI Systems