Die are processed with forces as low as 10 grams applied to the component. Force values are programmed per component type, which means that each die type can be picked and placed with its unique programmed and controlled force.

The vision system aligns and places die according to substrate fiducials, the die edge, or relative to features of previously-placed die; ensuring repeatable and precise alignment of optical and microwave devices.

• Boundary trace and/or pattern recognition is used to locate the die center, edges, or any other application-critical features.
• Fast orientation enables die such as MMICs and lasers to be used directly from the supplier without any need for pre-orientation.
• Global and local vision alignments are used for nested substrates and feature alignment. This enables fast, error-free processing of complex assemblies.

The MRSI-705HF’s vision system features multiple magnification and programmable lighting for both upward and downward facing cameras.

Red, green and blue programmable lighting is a powerful tool when processing challenging alignment surfaces such as gold on alumina. Such an advanced vision toolbox ensures optimum performance, which directly translates into less machine interruptions due to vision errors.

The MRSI-705HF’s control platform provides smoother and more precise control with up to 32 axes of motion, and a common controller for all axes including the conveyors. Computer hardware configuration features front USB ports for ease of use and dual hard drives with ghosting for optimum data security and minimum down time/immediate recovery.

SMEMA compatibility allows integration of the MRSI-705HF with a wide range of equipment including in-line ovens for a turnkey production solution. MRSI Systems reliability combined with our worldwide service and support commitment means that your system will always be available for production.

Benefits: 

• Easily integrated into automated production lines, both the in-line and cassette-to-cassette tooling options allow for greater machine autonomy, translating into a workload reduction and less setup downtime.
• Standalone tooling allows for greater flexibility required for R&D and small lot production, translating into faster changeover and therefore higher machine efficiency.
• Existing customer tooling, used upstream and or downstream from the assembly step, can be adapted; allowing streamlined product handling strategies to be implemented. Less product transfer means less operations, lower handling defect rates and improved cycle time.

Benefits: 

• Ability to assemble complex products with a multitude of component types. The overall reduction in production cycle time translates into higher throughputs and machine efficiency.
• Fast Product Change-Over means increased machine efficiency. Increased efficiency translates into higher output and lower manufacturing costs.

Benefits: 

• By using servo controlled synchronized systems, yield is increased by avoiding damaged and cracked die, especially for thin, fragile III-V material die, with internal or surface features.

• Production volumes are increased by eliminating pick error caused by wafer theta to the ejector pins alignment, especially for high aspect ratio devices.
• Wafer result mapping and ink dot recognition assures only know-good-die are used, thus ensuring a high yield. Fast change ejector needles and domes maximize system uptime.

Both direct eutectic and reflow eutectic bonding processes are supported. The package includes a reflow station with a hi-speed temperature ramp (closed loop pulse heating). A heated cover gas of Hydrogen and Nitrogen is present over the hot plate. The reflow station design includes provisions for vacuum hold down or part clamping. The system automatically transports the substrate or package to and from the stage for eutectic bonding.

The eutectic station is programmable, tailoring the process to your specific bonding requirements.

• Contact Forces are closed-loop controlled
• Temperature ramp rates are programmable, optimizing the heating profile while avoiding thermal shock.
• Multiple temperature setpoints are programmed to bring the substrate to a base temperature, followed by a final rise to the reflow temperature, as the part is placed.
• A programmable mechanical scrub may be used to break through oxide layers, thereby ensuring overall bonding quality.

Benefits:

• This optional package permits a portfolio expansion to offerings of hermetically-sealed packages. In addition to packaging of high power devices such as amplifiers, a path is provided for mass production of photonics/optical assemblies.
• The fully automated process ensures repeatable results, equating to higher yields, and an improved bottom line.
• Programmable fast ramping eutectic stage allows process flexibility, while maximizing throughput.  Well controlled cover gas flow and temperature minimizes voiding.  Vacuum and mechanical part clamping flexibility eliminates part movement during eutectic bonding. A tightly controlled process ensues. Higher yields and repeatable quality is the outcome.

The in-line material handling system loads a carrier of substrates (boat) onto the conveyor. The conveyor transfers the boat to the bonding area.

• Substrates are incrementally heated to the process temperature by processing through preheat zones.
• At the bond station parts come into contact with the pulse heated bonding stage and the eutectic bonding process is performed.
• The boat is then indexed to the next substrate position and the above process is repeated until all the boat positions have been assembled. As the indexer transfers the boat, the packages are incrementally cooled by passing over a cool down zone position. When completed, the indexing conveyor transfers the boat to the output magazine loader.
• Various bonding processes are supported:

• For Gold Silicon direct eutectic, the system aligns the package and then picks and places the die, and scrubs (variable amplitude and frequency) to accomplish the eutectic bond. A heated cover gas of Hydrogen and Nitrogen is present over the bonding area.
• For solder reflow eutectic bonding, such as Gold Tin (Au/Sn) eutectic attach of Gallium Arsenide (GaAs) and Gallium Nitride (GaN) die, the system aligns the package and picks and places a preform onto the package (if required, the preform can be pre-deposited). The die is then picked and placed, while the temperature at the bonding position is ramped using a pulse-heated eutectic stage and scrubbed (variable amplitude and frequency) to accomplish the eutectic reflow. A heated cover gas of Hydrogen and Nitrogen is also present over the bonding area.

Benefits:

• Improved productivity through automation. Scalable to high volumes.
• Expanded Portfolio, as capability is extended to high-power semiconductor packages requiring high heat dissipation rates.
• Investment protection if re-configuration becomes necessary. Machine retains its base modular nature.

The UV option includes specialized UV epoxy dispense hardware, as well as curing accessories. This includes easy-clean, accurate time/pressure dispense pumps for short pot-life materials.

Auto-shutter light guards on the dispense needles ensure that the dispense needle tips do not clog due to inadvertent UV exposure.

Benefits:

• Provides advanced assembly capability on a flexible platform base.
• Fully automated process ensures high yields and reduced labor costs.

The addition of dispensing pumps on the MRSI-705HF provides precise control of epoxy volume when dispensing small dots or area fills. Main features include:

• Closed loop servo motors
• A three-point laser height sensor provides the ability to determines the tilt of each surface on which material will be dispensed.
• Automatic needle cleaning
• Automatic needle alignment enables fast setup and switching between pattern types.
• Automatic software calibration routine using through beam sensors
• Automatic priming
• Line drawing capability
• Superior bond line thickness control
• Dot sizes down to 0.004” (100 microns)

Benefits:

• Avoid the purchase of a separate dispensing machine. Ideal for R&D environments, prototyping and low volume production.
• Minimize floor space
• Reduced Setup time
• Scale up with an MRSI-175Ag when volumes ramp. No need to re-qualify.
• Investment Protection through ability to reconfigure the base platform.

Stamping (or daubing) tools are interchangeable with standard pickup tools and are used to create very small epoxy dots by touching down in the stamping well and then onto the substrate. Single dots as small as 0.004″ (100 microns) are possible. They may also be ganged for higher throughput.

Benefits:

• Portfolio Expansion – Added capability of small die processing, multi-chip modules.
• Solution for die attach of small die
• Solution for die attach of complex module assembly with die of varying sizes and varying epoxy materials.
• Minimize floor space
• Reduced setup time
• Investment protection through ability to reconfigure the base platform

The challenges of the bonding co-planarity could result from large size of a die, a die with a high aspect ratio between length and width, the wedge effect along thickness of a die and/or a carrier, etc. MRSI Systems’ production-ready and time-proven technology compensates for these conditions and enables optimal device attachment, be it electrical interconnects or optical paths. Innovative in design, Die Bonding with Co-planarity Adjustment supports a wide variety of applications satisfying Optical Communications, Industrial Lasers, LiDAR, Aerospace, Medical, and more.