MRSI-LEAP High-Speed Die Bonders

Applications & Features 

• The MRSI-LEAP is designed for high-volume manufacturing applications of optical modules, including Chip-on-Carrier (CoC), Chip-on-Submount (CoS), and Chip-on-Baseplate (CoB) assemblies utilizing epoxy stamping die bonding.
• Machine accuracy is ±1 µm @ 3σ with Pick & Place throughput exceeding 1,000 UPH.
• Material input methods include wafer, Waffle pack, Gel-Pak®, and customized fixtures.
• The system is equipped with a conveyor designed for single fixture or multiple cassette inputs. It can automatically transport large carriers of dies for Active Optical Cables (AOC) or similar chip-on-printed circuit board (PCB) applications, gold-box packaging, and CoC assemblies in fixtures.
• Flip-chip bonding, UV epoxy dispensing, in-situ UV curing, wafer-level packaging, and other processes are available options.

Value to our Customers 

• Industry-leading throughput and ultra-high accuracy in high-volume manufacturing, with a pick-and-place process capable of achieving over 1,000 units per hour (UPH).
• The machine achieves an accuracy of ±1µm at 3σ, ensuring long-term stability and high precision.
• Easy to use icon-based interface running on a Windows™ platform for ease of programming, and low-cost machine maintenance.
• Industry-leading local technical support teams and application expertise
• 40+ years of experience in the industry with reliable 24/7 field operation

Configuration Highlights

• Powerful machine vision and tool design
• Module design, easy configuration, and system upgrade
• Supports 2 x 8 inches and 2 x 6 inches wafers with tool changes
• Built-in conveyor and magazine design for super-high efficiency and throughput
• Auto-dispenser and UV cure options available