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2 MAI 2017, 19:00
NEWS
DIE BONDING SOLUTIONS

MRSI Systems is a frequent participant at OFC. OFC gave us an opportunity to meet with our customers and friends, showcase our solutions, and learn new things that are centered around our historical strengths in photonics and optoelectronics packaging solutions. Thank you for visiting MRSI at OFC.

There were informative technical and industrial sessions exploring the current status and future developments in the industry. According to the OFC report, OFC 2017 featured over 650 exhibits from major international corporations. There were 14,500 attendees from 72 countries at the conference this year. The consensus was that we just got started on 100G volume deployment in data center and the 5G wireless/400G upgrade will most likely happen around 2020.   From the die bonding equipment supplier’s viewpoint, it is great to see further verification of our understanding that we cannot just “borrow the machines” from the highly standard semiconductor electronics industry with extremely high volume. The volume of photonics is not high enough for those expensive specific machines, yet the designs and manufacturing processes of photonics are far more complex and lack a sufficient level of standardization. As a result, our customers need die bonding solutions that can perform multi-chip and multi-process production in one machine. And this kind of flexibility cannot come with sacrificing speed/throughput or placement accuracy. We are glad that we are the leader in providing die bonding solutions with speed, accuracy, and flexibility to our customers in the photonics industry.

MRSI Products and Solutions

MRSI Systems was a proud sponsor of the 2017 Photonics Society of Chinese-Americans OFC Workshop together with other distinguished companies. Dr. Yi Qian, Vice President of Product Management, MRSI Systems participated in the workshop and networking event. The title of the workshop was “The Emerging Technologies Enabling the Next Generation Networks.” Co-organized by The Optical Society (OSA), China International Optoelectronic Expo (CIOE) and Wen Global Solutions. The panel discussion comprised speakers from Fabrinet, Google, Hisense Broadband, Finisar, and Ovum. The encouraging messages were that the China market uptrend direction is intact with the 100G provincial upgrade coming soon. The delay in project awards from Chinese carriers in the first quarter of 2017 was temporary and related to the timing of the Chinese New Year and the government’s new initiatives. The 5G wireless deployment in China may be ahead of the rest of the world.

We look forward to seeing you at OFC 2018, San Diego, CA – MRSI Booth #4444.

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