Case Study – The Latest Die Bonding Solutions for Photonics Manufacturing

Challenge

The optical communications industry is facing a generational change to its supply chain driven by a dramatic increase in demand from internet traffic and the related bandwidth required. This has brought the challenge of high volume photonics manufacturing with a high mix of products to an unprecedented level. The challenge becomes even greater combined with the just-in-time demand supply model from hyper-scale data center applications in recent years.  With the need to scale to high volume production, our photonic component customers were looking for a die bonder that could meet their need for high volume and multi-chip production.

Solution

Increasingly the industry is reaching out to MRSI Systems for a key element to their solution – a high speed, automated die bonder without sacrificing flexibility or precision. The MRSI-HVM3 die bonder family is able to handle multiple applications with quick changeover and little downtime. Many of our photonics manufacturing customers are stating the same reason for their choice – MRSI had the correct die bonder solution for true multi-chip, multi-process, and multi-product manufacturing with the best-in-class high throughput. The MRSI-HVM3 family has the following options inherited from our long proven MRSI-M3 family: localized heating, flip-chip bonding, and co-planarity bonding. These options are increasingly critical for new applications such as 400G transceivers and silicon photonics.

This MRSI-HVM3 die bonding product family can be used in a flexible way for high mix production for all key automatic process steps such as chip-on-carrier or submount (CoC or CoS), passive collimator lens attach, parts into gold-box, active optical cables (AOC), and other dies onto printed circuit board (PCB). The die bonder’s superior performance is enabled by dual head, dual stage, integrated “on-the-fly” tool changer, ultrafast eutectic stage, and multi-levels of parallel processing optimizations. As a high speed, highly flexible die bonding system the MRSI-HVM3 is able to provide parallel processing and speed with the ability to perform material handling and die bonding steps in parallel. “On-the-fly” tool change enables switching tools quickly without adding extra time to the process for a variety of parts within one process flow.

Results

The photonics component market requires the ability to scale quickly when high volume is required and to change over between products at minimal cost when the product demands change. The MRSI-HVM3 die bonder family has proved to be exactly the type of die bonding systems to support these needs. The products have been installed worldwide at multiple tier 1 companies and are serving customers’ 24/7 productions. The MRSI-HVM3 delivers industry-leading speed, future-proof high precision (< 3 micron), and superior flexibility for true multi-process, multi-chip, high-volume production.

About MRSI Systems

MRSI Systems (Mycronic Group), is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on- carrier (CoC), PCB, and gold-box packaging. 

Contact MRSI Systems today to learn more about our “one-stop-shop” die bonding solutions.