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10 MAI 2023, 16:53
NEWS
DIE BONDING SOLUTIONS

Dr. Limin Zhou, General Manager, MRSI Automation (Shenzhen) Co., Ltd., Senior Director of Strategic Marketing, MRSI Systems will present “Discussion on New Challenges and Solutions of Chip Assembly Technology” at the CHIP China Conference. This speech touches on how chip assembly technology plays a crucial role in emerging fields such as modern information technology, 5G communication technology, artificial intelligence, electric vehicles, and green energy. In the post Moore era, the advanced assembly technologies of semiconductor chips and the new assembly technologies of compound semiconductor chips are the core and key technologies supporting the development of these rapidly growing emerging industries. His speech will focus on the assembly of compound semiconductor chips. By analyzing the new features and challenges of advanced compound semiconductor chip assembly, it demonstrates MRSI’s solutions to address these new challenges in terms of equipment and processes. Finally, some application demos will be shown.

This prestigious event will be held from May 23-24th at the Suzhou Shishan International Conference Center.

Further information can be found at this link:MRSI sincerely invites you to participate in the “Semiconductor Advanced Technology Innovation Development and Opportunity Conference” in Suzhou

CHIP China May 2023 presentation