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23 MAI 2017, 22:00
NEWS
DIE BONDING SOLUTIONS

MRSI Systems is exhibiting at the 67th ECTC focused on the global microelectronics packaging industry.

The conference includes technical and panel sessions about the latest insights in advanced packaging, optoelectronics, high-speed, wireless & components, and emerging technologies.

ECTC has over 100 exhibiting companies covering the entire semiconductor supply chain. This is a great event for microelectronic packaging industry professionals.

Visit MRSI Systems at ECTC in Lake Buena Vista, Florida May 30-June 2, at the Walt Disney World Swan and Dolphin Resort. The IEEE Components, Packaging and Manufacturing Technology (CMPT) Society sponsors ECTC.

For more details visit the ECTC website.

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