How to Choose a Die Bonding System

Advanced imaging techniques using pattern recognition are needed to orient and align components positioned in a variety of trays and feeders with different background colors and perform fiducial recognition on a huge variety of shapes and features. Force control during the picking and placement operations is necessary. For assembly houses and OEMs involved with hybrid assembly, the machine requirements vary greatly from one job to another. Are you performing a complex application, such as hybrid assembly? Are you looking for a die bonding system that offers maximum flexibility and speed when it comes to the range of components and substrates handled, die presentation schemes, and process-related capabilities? Are you looking to scale capability beyond new product introduction?

Choosing the correct die bonding system is all about asking the key questions and answering them. We believe this implies that advanced manufacturers should be assessing not just the system from the die bonding vendor but the quality of the human interaction with the die bonding vendor.

These are complex decisions that require collaboration between your procurement team and the sales and engineering team from the die bonding supplier. These die bonding systems should meet the exact specifications for your needs. Below we have set out the type of options that should be demanded from your vendor and why they are important.

Die Bonding Key Functionality

Whether it is dispensing or stamping multiple epoxy bonding materials, or handling a high-count of varied components types, your vendor system must offer the ultimate flexible platform for demanding environments.

The die bonding system should meet the highest standards of reliability and dependability and be recognized by the market as the industry standard, with single digit micron accuracy.  The die bonding system must have a flexible configurable platform with a track record of an installed base in advanced packaging across a wide range of market segments, such as optoelectronics, life and health sciences, aerospace & defense, automotive, lighting, communications, and more.

Today, your die bonding system should be configurable to include all of the following functions:

Material Handling – Tooling is modular, ensuring fast, easy change-over between production runs. The die bonding system should support three modes of operation when it comes to product presentation. They are: in-line conveying, cassette-to-cassette load/unload, or stand alone mode. The die bonding system’s conveyor readily handles boats, fixture trays, lead frames and boards.

Tool Change – A significant number of pick-up and stamping tools on board – The MRSI-M3 features a thirteen-position tool bank with fast automatic tool change. Additional tool change banks are added for a wider range of tools. The tool change banks hold round surface pick-up tips, perimeter and inverted pyramid collets, and stamping tools. This is particularly well suited for processes requiring a large number of parts-specific tools, such as eutectic bonding applications.

Wafer Processing – Direct Pick from Wafers minimizes die handling and simplifies the supply chain – The die bonding system automatic wafer feeder includes automatic theta compensation, servo-controlled, synchronized, closed-loop movement of the pick head and the ejection needle, wafer mapping, ink dot detection, and fast change ejection needle clusters. Needless ejector system is available for ultra-thin devices. Thin and fragile die are delicately picked from the wafer tape by synchronizing the movement of the pick head and the ejection needles. Automatic theta compensation aligns the die to the needle cluster via the theta axis. Wafer maps or ink dots are supported, ensuring that only the good die are processed.

A World Class Die Bonding System delivers these outcomes:

• Flexible Component Supply Options– The die bonding system is configured to meet the needs of your supply chain requirements (waffle pack, Gel-Pak®, wafer, tape and reel and custom trays).
• High Speed AND High Accuracy– An advanced axis system driven by brushless DC linear servomotors with linear glass-scale encoder feedback for high speeds and accurate movements.
• High Machine Efficiency AND High Product Quality– Built-in internal temperature monitoring ensures consistent placement. Known heat sources, such as motors are designed with gas cooling; ensuring that thermal expansion is kept to a minimum.
• Optimum Placement Yields– The system’s closed-loop force control enables placement of delicate devices with as little as 10 grams of force. At the other end of the scale, forces up to 2kg are programmable.
• Maximum Asset Use –Your die bonding system is designed to handle a wide range of processes. Epoxy dispensing pumps, epoxy stamping and eutectic die bonding with scrub and temperature control, are all configuration options.
• Strongest ROIs in the industry – A well-established platform with an unmatched Cost of Ownership.
• Extended Machine Lifetime – Exceptional performance over time. Upgrade paths as new features are introduced.
• Proven Manufacturing Readiness – A work horse with minimum downtime. Compelling reliability.
• Configurable Asset – The die bonding system is an open platform that adapts to changing portfolios and can handle complex multi-chip modules and other advanced assembly challenges with ease.

About MRSI Systems-Die Bonding and Epoxy Dispensing Solutions

MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonding and epoxy dispensing systems. We enable customers to optimize the performance of their process including yield, throughput, and uptime by building systems that use our unique expertise. In summary, this includes our proprietary software, proven hardware, deep process knowledge, state-of-the-art manufacturing, and a world-class customer service team. MRSI’s systems are built on common platforms that can be configured to meet specific customer requirements. These platforms are designed to be scalable for R&D prototyping, pilot production and high volume manufacturing. Our solutions deliver the best financial returns in the industry while integrating seamlessly into our customer’s production. Markets include Telecom/Datacom (Data Center), Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial. Since 1984, we have been recognized as the standard of the industry, delivering our solutions to leading optoelectronic and microelectronic customers worldwide. We are headquartered in Billerica, MA in the greater Boston area. Our sales are supported by a global network of direct service and support professionals, located in China, Taiwan, Singapore, Korea, Thailand, Malaysia, the Philippines, Israel, Europe, United Kingdom, and the United States.

That should be your procurement requirements and we would be delighted to demonstrate how we meet that specification. Contact MRSI Systems to see how we can help solve your assembly challenges – sales@mrsisystems.com.