Go to main content
25 AVR. 2017, 21:00
NEWS
DIE BONDING SOLUTIONS

The International Microelectronics Assembly and Packaging Society New England Chapter’s Symposium will be held in Boxborough, MA on May 2nd, 2017. The keynote address – “From Interconnect to Innovation in the DoD” will be presented by Dr. Livia Racz from MIT Lincoln Laboratory.

MRSI Systems is a GOLD sponsor of the iMAPS NE Symposium. Dr. Yi Qian, VP of Product Management, MRSI Systems is chairing a technical session “Nanoelectronics and Optoelectronics.” Presenting papers are tenured professors from MIT and UMass, and Peter Cronin, Director of Applications and Service, MRSI Systems.

Other technical sessions include: MEMS, RF & Microwave Innovations, Emerging Technologies, Medical Device Packaging, Thermal Management, and Printed Electronics. For more information: iMAPS New England

For the latest advanced packaging news subscribe to the blog.

MRSI blog and newsletter sign up

By submitting this form, you are consenting to receive marketing emails from: MRSI Mycronic, 554 Clark Road, Tewksbury, MA, 01876, US. You can revoke your consent to receive emails at any time by using the Safe Unsubscribe® link, found at the bottom of every email. Emails are serviced by Constant Contact. 

Submitting means that you consent to having your personal data processed in accordance with the privacy policy

By submitting this form, you are consenting to receive marketing emails from: MRSI Mycronic, 554 Clark Road, Tewksbury, MA, 01876, US. You can revoke your consent to receive emails at any time by using the Safe Unsubscribe® link, found at the bottom of every email. Emails are serviced by Constant Contact. 

Submitting means that you consent to having your personal data processed in accordance with the privacy policy