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14 JUIL. 2020, 21:00
NEWS
DIE BONDING SOLUTIONS

The world’s largest Microwave and RF industry event is being held virtually this year. 

MRSI Systems invites you to IMS 2020 Virtual Eventfrom August 4-6, 2020Visit the MRSI digital booth to learn about our die bonding and epoxy dispensing solutions for RF and Microwave applications. 

The symposium includes technical and panel sessions about the latest insights such as Power Amplifiers, Advanced MEMS, IoT, 5G Applications, and Wireless Communications. 

Many of MRSI’s long-standing customers are RF and Microwave leading component manufacturers. From Transmitter and Receiver Modules to Power Amplifiers, MRSI has been the die bonding platform of choice for these manufacturers. 

Exhibition Live Hours Each Day, August 4-6, 2020:
09:00 – 13:00 (Europe focused)
13:00 – 17:30 (US focused)
17:30 – 21:00 (Asia focused) 

For more details visit the IMS website.