Laser Focus World Featured Article – Die-bonder innovations target HPLD manufacturing challenges
MRSI’s latest article in Laser Focus World’s February Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs) packaging manufacturing and presents an innovative flexible solution for both chip and bar on submount without changeover.
The paper presents all of the key challenges of packaging technology in HPLD manufacturing, and puts forward specific innovative automation solutions to these challenges. The feasibility of these innovative solutions are verified by experiments on MRSI-H-LD equipment. The experiments’ results show the flexible solution to address all of the die bonding process challenges for HPLD. The chip or bar on submount packages can be built within one machine without changeover. The unique combination of features of MRSI-H-LD provides a perfect die bonding solution for the high-volume and high-mix HPLD packaging production.
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