Go to main content
15 MAI 2024, 14:00
NEWS
DIE BONDING SOLUTIONS

Join MRSI at the upcoming Compound Semiconductor Advanced Technology and Application Conference (CSC) taking place on May 22-23, 2024, in Suzhou, China. Dr. Limin Zhou, the General Manager of MRSI Automation (Shenzhen) Co., Ltd., and Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group), will be presenting a groundbreaking session titled “A New Engine for the Development of Photonics Industry – Generative AI.”

Abstract:

The latter part of 2023 witnessed a surge in investments in artificial intelligence infrastructure, catalyzing the rapid mass production of 800G optical modules. Anticipations in the industry are set high, with demands for optical modules to deliver faster speeds, reduced power consumption, and lowered costs. In response, innovative material technologies and advanced packaging solutions are propelling the swift evolution of optical module technology.

The forthcoming generation of optical modules will leverage Silicon Photonics and thin film lithium niobate (TFLN) materials alongside CPO packaging. As the requirements for high-speed optical modules’ packaging grow more stringent, the efficiency of packaging processes becomes critical, directly influencing the cost-effectiveness and performance of the final products.

Key to the manufacturing of high-speed optical modules are die bonding and active alignment. MRSI stands at the forefront, offering comprehensive solutions tailored to current and future assembly demands, well positioned to grow with the industry.

For further details about the conference, visit 半导体先进技术创新发展和机遇大会 (compoundsemiconductorchina.net).