MRSI Systems Launches New Software Video Training Programs

These training videos will explain:

1. How to program your die bonding and epoxy dispensing systems e.g. how to teach a waffle pack and teach a tip collet to perform tasks.
2. The major features of our software platform common to our systems, including the intuitive graphical user interface running on Windows™, and how it simplifies the set-up and production process.
3. How to access the preprogrammed library of waffle pack and die.
4. How to set up calibration routines, offline programming.
5. How to turn a simple machine into a powerful tool to allow die and placement locations to be taught for use in the future.
6. Ability to use die in multiple programs and to reteach easily.
7. Alternate die capability allowing the system to automatically switch between alternate vendors of die.
8. Our sophisticated advanced vision systems, enabling rapid detection and orientation of die over a full 360°.

Specific features explained to enhance your experience include:

1. Windows-based systems that present an interface that feels natural and guides the user through the teaching process with wizards and other easy-to-use aids.
2. Sophisticated database structures permit control of many production parameters by even casual users.
3. Graphics are a helpful addition to the interface. Pickup tips can be ‘virtually’ overlaid on a die while it is being taught to make sure the tip size and tip pickup point are correct for die bonding. A die outline can be overlaid on the substrate to guarantee that the placement location is correct.
4. The die bonding system’s advanced vision system enables Boundary trace or pattern recognition is used to locate the die center or application-critical features. Fast and accurate orientation detection enables die such as MMICs and laser diodes to be used directly from the supplier, eliminating the need for pre-orientation. Global and local vision alignment schemes are used for nested substrates and features, enabling fast and error-free processing of complex assemblies in die bonding. The die bonding systems are configured with an upward looking camera that can be used for processing flip chips and other components with bottom features.
5. For epoxy dispense machines, camera mode simulation can draw the locations of the dispense tip while the machine traces out programmed patterns.
6. Further features of the epoxy dispensing video shows how the software handles a pre-programmed library of dots, lines, area fills, spirals, arcs, and star patterns. An easy-to-use tool makes these patterns easily customized to fit the application. Once taught, dispense programs are quickly optimized. Calibration routines, offline programming, and CAD download mean little time is spent programming and more time is available for production. Dispense programs generated on the MRSI-175Ag can be used to create placement programs on the MRSI die bonding systems.

Finally, the training videos are sold as a package and include these modules:

1. Teach Waffle Pack
2. Teach Waffle Pack 1 Point
3. Teach Die
4. Teach Die Two Pictures
5. Teach Die with Bumps
6. Teach Boat
7. Teach Alignment
8. Teach Substrate
9. Teach Multi-Up Alignment
10. Teach Tool Changer
11. Teach Tip Collet
12. Convert from Pick and Place to Dispense
13. Production Run

Contact MRSI to purchase the latest training videos to program your die bonding system and epoxy dispenser today. The software will be sold as a MP4 format to allow use at the machine with no need for internet access. Price points will include individual user licenses, group licenses up to 10 systems and site licenses.

About MRSI Systems

MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonding and epoxy dispensing systems. We enable customers to optimize the performance of their process including yield, throughput, and uptime by building systems that use our unique expertise. In summary, this includes our proprietary software, proven hardware, deep process knowledge, state-of-the-art manufacturing, and a world-class customer service team. MRSI’s systems are built on common platforms that can be configured to meet specific customer requirements. These platforms are designed to be scalable for R&D prototyping, pilot production and high volume manufacturing. Our solutions deliver the best financial returns in the industry while integrating seamlessly into our customer’s production. Markets include Telecom/Datacom (Data Center), Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial. Since 1984, we have been recognized as the standard of the industry, delivering our solutions to leading optoelectronic and microelectronic customers worldwide. We are headquartered in Billerica, MA in the greater Boston area. Our sales are supported by a global network of direct service and support professionals, located in China, Taiwan, Singapore, Korea, Thailand, Malaysia, the Philippines, Israel, Europe, United Kingdom, and the United States.