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MRSI Systems Participated in MIT Microphotonics Center / AIM Photonics Spring Technical Meeting in Cambridge

In March 2017, MRSI Systems participated in The MIT Microphotonics Center and AIM Photonics Spring Meeting for Integrated Photonics Manufacturing Meeting.

9 MAI 2017
16:30
NEWS
DIE BONDING SOLUTIONS

The theme for this year’s spring meeting was STATUS 2017 AND STRATEGIES FOR 2025 – THE INTEGRATED PHOTONICS SYSTEM ROADMAP. MRSI Systems was an active participant at the event and made special contributions to the Integrated Photonics Roadmap discussion and the panel discussion in the AIM Photonics Academy’s special meeting on Building the I-90 Integrated Photonics Corridor.

Integrated Roadmap Discussion

Dr. Yi Qian, Vice President, Product Management, MRSI Systems participated in the Assembly and Test roadmap group discussion. Dr. Qian emphasized the need for accuracy and flexibility without sacrificing speed from manufacturing automated equipment, in order to cover unique needs from the photonics industry, with more complex design, less standardization, and lower volume (even with future silicon photonics materialized in full), compared to the semiconductor electronics industry.

MIT AIM Photonics

* The photo courtesy of Denis Paiste of the Materials Processing Center at MIT

Panel Discussion

Dr. Qian also joined a panel discussing Adjacent and Latent Competencies for integrated photonics, moderated by Dr. Brian Anthony, Associate Director, AIM Photonics Academy for the discussion. The focus of the discussion was on gaps in the local eco-system to support building the I-90 integrated photonics corridor initiative.

Factory Tour & MRSI-M3 Demonstration

MRSI has installed a 3 μm die bonder (MRSI-M3) at the AIM Photonics Academy’s Workforce Education and Training Factory at MIT.  A group comprised of local educators, state representatives, and federal agents and industry professionals toured the new factory. An MIT Graduate student provided a live demonstration of the MRSI-M3 machine.

Learn more about MRSI’s Die Bonders

“MRSI Systems has been involved with the AIM Photonics Center and the MIT-led AIM Photonics Academy since its inception. It is a great opportunity for MRSI to continue participating in the integrated photonics roadmap activities and join Promex Industries Inc., LaXense Inc, and other MA local companies in this forum,” said Dr. Qian. “As a leading provider of high speed and high precision die bonding solutions to the photonics packaging industry for the past twenty-five years, MRSI is uniquely positioned in supporting the future silicon photonics industry, both locally and internationally. We are so close to MIT and there will continue to be a lot of opportunities for us to contribute to the workforce education and training at MIT. This demonstration was a great opportunity to show other photonics industry professionals and other interested parties the advanced solutions the MRSI-M3 Die Bonder offers for R&D and high volume manufacturing.”

See the MIT Education Factory with the MRSI-M3 Die Bonder

MRSI-M3 Die Bonder