MRSI to sponsor and present at IMAPS New England this May
MRSI Systems is delighted to announce another opportunity to see us this spring. We will be a featured Platinum Sponsor along with exhibiting at the upcoming 49th annual IMAPS New England Symposium and Exhibition.
Peter Cronin, Director of Sales North America, MRSI Systems, will be co-chairing the Photonics Session. Jack Inocencio, Sr. Manager of Applications & Services at MRSI Systems, will be presenting “Advanced Packaging for Heterogenous Integration.” The abstract of his speech reads “Advanced heterogenous integration for 3-D IC packaging, e.g chiplet, and optoelectronics packaging requires high precision die bonders that can perform many different processes, such as thermal compression bonding, DAF bonding, BGA/copper pillar bonding, eutectic bonding, hybrid bonding and more. In this talk, the industry leading WLP (Wafer Level Packaging) solution from MRSI with sub-micron accuracy will be presented.”
You do not want to miss this premier event covering the latest microelectronics packaging and photonics material. There will be eleven different presentation sessions covering industry level photonics and microelectronics. Find us there on May 2nd in Boxborough, MA! The event is held at Boxboro Regency Hotel & Conference Center. We cannot wait to see you there.
MRSI’s die bonding solutions for photonics packaging
Please visit the MRSI booth #406 to learn more about our die bonding and epoxy dispensing solutions for a wide range of applications.
Contact MRSI Systems to learn about our assembly solutions.
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