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12 MARS 2019, 20:00
NEWS
DIE BONDING SOLUTIONS

MRSI Systems is exhibiting at SEMICON China in Shanghai, March 20-22, 2019, at the Shanghai New International Expo Centre.

Please stop by the CYCAD Century Science & Technology Booth #2567. SEMICON China is the world’s largest Microelectronics Exhibition for the semiconductor industry. For more information: www.semiconchina.orgLASER World of PHOTONICS CHINA is collocated with SEMICON China which covers all optical technologies.  

MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products.  With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on- carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com. 

MRSI Systems has all-in-one solutions which are high precision, flexible, high speed, reliable die bonding systems. Our die bonding solutions are applicable for multiple market applications. We hope to see you there! 

Request a meeting during this event to learn more about our latest die attach solutions. 

Show Hours
March 20, 2019 

09:00 – 17:00 
March 21, 2019  09:00 – 17:00 
March 22, 2019  09:00 – 16:00