MRSI to present at IFOC and attend CIOE in September in Shenzhen including live product demos

MRSI Systems will exhibit at the 22^nd China International Optoelectronic Exposition (CIOE). Live product demos will be offered at MRSI’s booth #8E55. The show will be held at the Shenzhen World Exhibition & Convention Center from September 9-11, 2020.

MRSI will demonstrate the industry-leading 1.5 micrometer die bonder, MRSI-H-LD for high-volume manufacturing of advanced photonics and RF/microwave devices. The system is optimized for applications that bond large die for high-power semiconductor lasers, RF power amplifiers, active optical cables (AOCs), lighting, and sensors. This versatile assembly solution enables our customers to scale their business by delivering high throughput, high reliability, and high flexibility.

VP & GM MRSI Systems at Mycronic, Dr. Yi Qian states: “MRSI Systems has been servicing photonics customers for over 30 years. We have witnessed the rapid innovation and development of the photonics industry. This has given us the ability to anticipate our customers’ needs to provide industry-leading manufacturing solutions to generate the best ROI for our customers. Through constant innovation, we continually improve our products and provide world-class service to our worldwide customers at local and global levels as we grow together with our customers.”

CIOE is regarded as one of the premier events where leading players unveil their latest products.

• At CIOE’17, MRSI introduced the most flexible, high-speed, high-precision, 3 micrometer die bonder HVM3-series product line. This series is driven by 40/100/200/400/800G technology evolutions, data centers, and 5G wireless applications. Since then, MRSI has successfully installed dozens of these systems worldwide.
• At CIOE’18, MRSI announced the extension of the HVM3 die bonder product line to cover all major applications for advanced photonics and launched new H3TO die bonders for TO-can based devices and H3LD for high power laser diode packaging.
• At CIOE’19, MRSI announced improved accuracy of 1.5 micrometers, for the set of products under their new names: MRSI-HVM and MRSI-H.
• At CIOE’20, MRSI will continue to announce innovative new products to support the latest photonics industry higher accuracy and higher speed manufacturing requirements. To find more details, visit MRSI CIOE’20 booth to talk with MRSI sales and engineers.

To better service customers in China, MRSI Systems offers product demonstrations and customer part prototyping at the Mycronic facility in the Nanshan District of Shenzhen, China. MRSI has on-site application engineers equipped with the most current process knowledge in the industry. Find out what the demo center has to offer and schedule an appointment with the sales team at sales.mrsi@mycronic.com.

For additional information, please contact:
Dr. Limin Zhou
Senior Director, Strategic Marketing, MRSI Systems
Tel: +86 135 0289 9401, e-mail: limin.zhou@mycronic.com
Time Zone: CST – China Standard Time

About MRSI Systems
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high- volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com