Go to main content

MRSI-H1 FAMILY

  • High speed
  • Advanced ultra precision solution for flexibility and speed
  • Ultra precision 1-micron flip-chip die bonders for high volume manufacturing

Benefits of MRSI-H1 Family 

The MRSI-H1 family provides proven superior flexibility for true multi-die, multi-process, multi-product, high-volume, high-mix production. These high-speed products deliver the industry-leading speed without sacrificing flexibility, precision or reliability. The MRSI-H1 family targets the manufacturing challenges driven by AI cluster expansion, wireless network rollout and LIDAR market for autonomous driving.

MRSI-H1

  • This standard system is widely used in advanced photonics such as lasers, receivers, transceivers, lighting, and sensors, etc.
  • Carries key technological building blocks from our field-proven, flexible and high-speed MRSI-HVM platform
  • Heated head option designed for the higher density eutectic packaging
  • “On-the-fly” patented auto tool changer has twelve vacuum tips/collets integrated on the bonding head for zero time tool change

Value to our Customers

  • Industry leading throughput, superior flexibility, and ultra-high-accuracy in high-volume, high-mix manufacturing
  • Easy to use icon-based interface running on a Windows™ platform for ease of programming, and low-cost machine maintenance.
  • Industry leading local technical support teams and application expertise
  • 40+ years of experiences in the industry with reliable 24/7 field operation

Images

Brochures

MRSI-H1

For detailed Data Sheets please contact Sales.

MRSI-H1

Une erreur s'est produite lors de l'obtention de l'image captcha

Contact us

Contact us

Do you want to know more about our products? Please contact us.
Une erreur s'est produite lors de l'obtention de l'image captcha