MRSI-H1 FAMILY

High speed
Advanced ultra precision solution for flexibility and speed
Ultra precision 1-micron flip-chip die bonders for high volume manufacturing

Benefits of MRSI-H1 Family

The MRSI-H1 family provides proven superior flexibility for true multi-die, multi-process, multi-product, high-volume, high-mix production. These high-speed products deliver the industry-leading speed without sacrificing flexibility, precision or reliability. The MRSI-H1 family targets the manufacturing challenges driven by AI cluster expansion, wireless network rollout and LIDAR market for autonomous driving.

MRSI-H1

This standard system is widely used in advanced photonics such as lasers, receivers, transceivers, lighting, and sensors, etc.
Carries key technological building blocks from our field-proven, flexible and high-speed MRSI-HVM platform
Heated head option designed for the higher density eutectic packaging
“On-the-fly” patented auto tool changer has twelve vacuum tips/collets integrated on the bonding head for zero time tool change

Value to our Customers

Industry leading throughput, superior flexibility, and ultra-high-accuracy in high-volume, high-mix manufacturing
Easy to use icon-based interface running on a Windows™ platform for ease of programming, and low-cost machine maintenance.
Industry leading local technical support teams and application expertise
40+ years of experiences in the industry with reliable 24/7 field operation