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MRSI-H Family

MRSI-H Family

  • High speed and flexible
  • 1.5-micron flip-chip die bonders for high volume manufacturing
  • Advanced high accuracy solution for flexibility and speed

Benefits of MRSI-H Family 

The MRSI-H family provides proven superior flexibility for true multi-die, multi-process, multi-product high volume high mix production. These high-speed products deliver the industry-leading speed without sacrificing flexibility, precision or reliability. The MRSI-H family targets the manufacturing challenges driven by AI cluster expansion, wireless network rollout and LIDAR market for autonomous driving. MRSI reclassified H series by application.

MRSI-H-LD 

  • This standard system is widely used in advanced photonics such as lasers, receivers, transceivers, lighting, and sensors, etc. 
  • Carries key technological building blocks from our field-proven, flexible and high-speed MRSI-HVM platform 
  • Heated head option designed for the higher density eutectic packaging
  • “On-the-fly” patented auto tool changer has twelve vacuum tips/collets integrated on the bonding head for zero time tool change

MRSI-H-HPLD 

  • Specifically designed for bonding large high-power laser diodes in mass production
  • Capable of die bonding single emitter, bar laser in different packages, like CoS, C-mount, Bar-on-Submount(BoS), etc. within one machine 
  • Customized design self-leveling tools for Co-planarity solution

MRSI-H-HPLD+

  • Enhanced MRSI-H-HPLD with significantly higher speed.

MRSI-H-LDMOS 

  • Specifically designed for bonding GaAs, Si, GaN, SiC dies for RF Power Amplifiers and Microwave Applications in mass production 
  • Programmable die scrubbing process for a void free bonding process
  • Inline heaters, conveyors and loader/unloader options for improve UPH

MRSI-H-TO 

  • Specifically designed for handling multi-dies and multi-processes for complex TO products without tool changeover. e.g. TO-based EMLs and WDM LDs for 5G
  • TO handling module combined with pick and place head for dual parallel processing
  • Capability of both epoxy and eutectic die bonding in one process flow
     

Value to our Customers 

  • Industry leading throughput, superior flexibility, and ultra-high-accuracy in high-volume, high-mix manufacturing
  • Easy to use icon-based interface running on a Windows™ platform for ease of programming, and low-cost machine maintenance.
  • Industry leading local technical support teams and application expertise
  • 40+ years of experiences in the industry with reliable 24/7 field operation

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MRSI-H

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MRSI-H

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