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Manual flying probe for PCB test
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atg Luther & Maelzer GmbH (HQ)
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MRSI Automation (Shenzhen) Co., Ltd.
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Axxon
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Mycronic is a global high-tech company that develops, manufactures and markets production equipment that meets the electronics industry’s high demands for precision, flexibility and efficiency.
Visit page Product areas
PCB assembly
製品ラインアップ
SMT assembly
Stencil printing
MYPro S20
MYPro S30
ジェットプリンター
MY700JP
MY700JX
MY700JD
はんだ検査機
PI Pico - 3D SPI
PI Primo - 3D SPI
マウンター
MY300DX
MY300SX
MY300LX
MY300HX
MY300EX
自動光学検査システム
MYPro I50
MYPro I51
MYPro I81
MYPro I91
部品保管システム
MYTower 5
MYTower 6
MYTower 6+
MYTower 7+
MYTower 5x
MYTower 6x
プロセスソフトウェア
MYPro Link
MYPro Connect
MYCenter Analysis
ディスペンサー・コーティング
産業用ディスペンサー
MYC60
コンフォーマルコーティング
MYC10
MYC50
Conformal coating valves
I70X
インラインディスペンサー
MYD50
MYD10
MY700JD
Dispensing valves
テーブルトップディスペンサー
MYT50
MYT10
サービス
MYCare service contracts
Financing
ソリューション
PCB assembly solutions
Case stories
ウェビナーとイベント
Live events
Webinars
News and press releases
News
About us
MYNews magazine
Photomask equipment
Products
Display mask writer
Semiconductor mask writer
Multi-purpose mask writer
Display mask metrology system
Semiconductor mask metrology system
About us
Solutions
Large area measurement
LCD displays
Smartphone displays
News
More virtual interactions, and the rise of a metaverse
Service & support
Career
Why work at Mycronic?
Meet your new colleagues
Who are we?
Student opportunities
Contact us
Mycronic Sweden HQ
Bare board testing
About us
History
Products
Manual flying probe for PCB test
A5 Neo
A7 Pro
A7-16 Pro
A7XW Pro
A9
A9 plus
Automated flying probe for PCB test
A7a Pro
A9a
A9aL
A9a plus
Flying probe for substrate test
S2-8 / S2-8 plus
S2-16 / S2-16 plus
S3
S3-8
Fixture based test systems
LM1000
Services
Bareboard spare parts, consumables & accessories
Service solutions Bareboard testing
Solutions
Flying ahead in Michigan with Calumet
News & events
All news
Events
TPCA 2024
HKPCA 2024
Career
About us at Bareboard testing
Apprenticeship program
Job advertisements
Reinigungsfachkraft (m/w/d)
Mechatroniker (m/w/d)
Contact
atg Luther & Maelzer GmbH (HQ)
Die bonding solutions
About us
History
Service & support
Why do customer's choose MRSI?
Career
Partners
Testimonials
Products
High precision flip-chip die bonders
Submicron Die Bonders
1 Micron Die Bonders
1.5 Micron Die Bonders
3 Micron Die Bonders
5 Micron Die Bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners - MRSI-A-L
Prototyping and training services
Prototyping
MRSI Systems Training Services
Applications
Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
TO-TOSA/ROSA
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Processes
Die bonding
Eutectic die bonding
Epoxy die bonding
News & events
Events
Webinars
Press releases
News
Cases
Gallery
Video gallery
Newsletters archive
Contact us
MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Photonic Interconnects
Dispensing and coating
Axxon
About us
Always one micrometer ahead
Key facts about Mycronic
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Mycronic is a world-leading provider of flexible, high-precision production solutions for electronics manufacturing. We strive to keep our customers at the forefront of the industry by offering innovative, sustainable, high-quality production solutions with long product life cycles – solutions designed around the people who use them.
Visit page About us
Always one micrometer ahead
Key facts about Mycronic
Strategy
History
Purpose & vision
Expertise & innovation
Organization
Sustainability
Our sustainability commitment and goals
Our sustainability impact
Key area: Innovation for sustainability
Key area: Future engineers through diversity
Key area: Climate impact
Responsible business practices
WEEE
Policies
Code of Conduct
Distributor Code of Conduct
Supplier Code of Conduct
Supplier Code of Conduct for Service Providers and non-critical Suppliers
Quality & environmental policy
Diversity, equity & inclusion policy
Health & safety policy
Anti-corruption policy
Whistleblower policy
Certificates
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Mycronic as an investment
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Capital markets day 2022
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Through focus on innovation and organic growth, together with an active acquisition strategy and healthy profit contributions from all divisions, Mycronic is well-placed to continue its growth journey.
Visit page Investors
Mycronic as an investment
Mycronic share
Information about the share
Key ratios Mycronic
Shareholders
Insiders
Subscribe to IR news
Consensus Estimates
Financial & sustainability targets
Financial reports
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Capital markets day
Capital markets day 2022
Governance
Framework for corporate governance
Board of directors
Executive management team
Remuneration to the CEO
Auditor
Committees
Nomination committee
Audit committee
Remuneration committee
Annual general meeting
Contact Investor Relations
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Think of the most high-tech electronics products you can imagine. Then think one step further. What technology creates the most advanced high-tech of today? Ours do.
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Mycronic Sweden HQ
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Visit our contact page for contact details for our sales and support departments.
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Mycronic Sweden HQ
Mycronic Benelux
Mycronic China
Mycronic France
Mycronic Germany
Mycronic atg Luther & Maelzer GmbH (HQ)
Mycronic Vanguard Automation GmbH
Mycronic Japan Fukuoka
Mycronic Japan
Mycronic Singapore
Mycronic South Korea
Mycronic UK
Mycronic USA
Axxon China
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Mycronic Mexico
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News & events
Our events
Upcoming Events
Past Events
11月20日 - 11月21日
Online
Automotive LIDAR 2024
7th Annual Conference and Exhibition. MRSI Mycronic will be presenting.
Die bonding
United States of America
English
12月4日, 08:00 - 12月6日, 18:00
at Shenzhen World Convention & Exhibition Center (Baoan), Shenzhen
HKPCA 2024
Bare board testing
China
English
1月21日, 2025 - 1月23日, 2025
Santa Clara, CA USA
Chiplet Summit 2025
MRSI Mycronic is sponsoring the Chiplet Summit at the Santa Clara Convention Center.
Die bonding
United States of America
English
1月28日, 2025 - 1月30日, 2025
San Francisco, CA USA
SPIE Photonics West 2025
Photonics West is the world’s premier event for lasers, biomedical optics, biophotonics, quantum, and optoelectronics. Booth: #5407
Die bonding
United States of America
English
2月26日, 2025 - 2月28日, 2025
Marina Bay Sands Singapore
Asia Photonics Expo 2025
MRSI Mycronic will exhibit at the Asia Photonics Expo 2025.
Die bonding
Singapore
English
3月3日, 2025 - 3月6日, 2025
Phoeniz, AZ, USA
IMAPS Device Packaging Conference 2025
The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6, 2025.
Die bonding
United States of America
English
3月11日, 2025 - 3月13日, 2025
Shanghai New International Expo Centre (SNIEC)
LASER World of PHOTONICS CHINA 2025
Asia’s largest trade fair for the photonics industry in Shanghai New International Expo Centre (SNIEC)
Die bonding
China
Chinese
4月1日, 2025 - 4月3日, 2025
San Francisco, CA USA
OFC 2025
OFC is the world's largest event for optical networking and communications. MRSI Mycronic Booth: #3218
Die bonding
United States of America
English
4月9日, 2025
Filderhalle Leinfelden-Echterdingen
EPP InnovationsFORUM⁺ 2025
Mycronic is attending the 2025 year edition of EPP InnovationsFORUM⁺
PCB Assembly
Germany
German
5月6日, 2025
Boxborough, MA, USA
IMAPS New England 2025
International Microelectronics Assembly and Packaging Society (IMAPS) New England 51st Symposium & Expo.
Die bonding
United States of America
English
6月17日, 2025 - 6月19日, 2025
San Francisco, CA
IMS - International Microwave Symposium 2025
IMS is focused on the microwave industry. MRSI Booth: #1629
Die bonding
United States of America
English
6月18日, 2025 - 6月21日, 2025
Bangkok, Thailand
Nepcon Thailand 2025
MRSI Mycronic will exhibit at Nepcon Thailand 2025.
Die bonding
Singapore
English
9月10日, 2025 - 9月12日, 2025
Shenzhen, China
CIOE – China International Optoelectronic Expo 2025
CIOE is the world’s largest optoelectronics event. Location: Shenzhen World Convention & Exhibition Center Shenzhen, China.
Die bonding
China
English
9月29日, 2025 - 10月1日, 2025
Copenhagen, Denmark
ECOC 2025
The ECOC Exhibition is the key meeting place for everyone in the fibre optic communication technology industry. Booth: #C4315
Die bonding
Denmark
English
10月7日, 2025 - 10月9日, 2025
Phoeniz, AZ USA
SEMICON West 2025
SEMICON West includes the extended microelectronics industry supply chain. Booth: #6268
Die bonding
United States of America
English
2024/11/12 22:22:13