About Die bonding
Under the MRSI brand, we leverage over 40 years of industry expertise in high-accuracy die bonders, active aligners, and fluid dispensers to deliver unparalleled reliability and precision for R&D, NPI, and high-volume manufacturing. Our commitment to excellence ensures we meet our customers' needs with meticulous attention to detail and 24/7 field support.
What is die bonding?
Die bonding is a manufacturing process used in the packaging of semiconductors. It is the act of attaching a die (or chip) to a substrate or package by epoxy or solder, also known as die placement or die attach. The process starts with picking a die from a wafer or waffle pack and then placing it at a specific location on the substrate. The die is placed into a previously dispensed epoxy or placed into solder (eutectic).
Learn more about our industry-leading die bonders and epoxy dispensers
In the case of eutectic die bonding, the process involves heat and gas management to control the solder's reflow conditions. Die bonding usually involves high accuracy at 1 to 3 µm, much higher than other packaging processes. Fully automatic high accuracy die bonders that are capable of epoxy and eutectic die bonding are the lifeblood of the modern semiconductor industry.
MRSI offers a broad suite of products across the volume spectrum, from research and development, low-to-medium volume production, and high-volume manufacturing, the MRSI product family can guarantee customer satisfaction down to the most niche details.