Newsletters archive

2019 

Volume LIII

MRSI Is Moving to Our New State-of-the-Art Facility

Customer Support and Training Programs

Trade Show News

Blog Insights

Volume LII

Visit MRSI at Productronica

Trade Show News

Blog Insights

Volume LI

Automotive LIDAR Conference and Exhibition 2019

MRSI to Sponsor and Exhibit at the 2019 International Symposium on Microelectronics

CIOE and Infostone Conference – Announcement of the Latest Advancement in the 1.5 Micron MRSI-H/HVM-series Product Line

Blog Insights

Volume L

MRSI to Present at 18th ICCSZ OC Market and Technology Seminar and Offer Die Bonder Demonstrations at CIOE

Visit MRSI at CIOE

MRSI Systems Welcomes Hendry He as China Country Sales Director

Blog Insights

Volume XLIX

Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility

Trade Show News

Blog Insights

Volume XLVIII

Flexible Automation Solutions to Accelerate LiDAR Automotive Applications

Trade Show News

Blog Insights

Volume XLVII

Visit MRSI at IMS in Boston

Trade Show News

Blog Insights

Volume XLVI

IMAPS New England 

Trade Show News

Blog Insights

Volume XLV

Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors

Trade Show News

Blog Insights

Volume XLIV

Visit MRSI Systems at OFC in San Diego

Trade Show News

Blog Insights

Volume XLIII

MRSI-H3LD for High Power Laser Diodes

Trade Show News

Blog Insights

2018 

Volume XLII

Holiday Greetings from MRSI Systems

Trade Show News

Blog Insights

Volume XLI

MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China

Customer Support

Trade Show News

Blog Insights

Volume XL

MRSI-HVM3 Family Expansion

MRSI-H3 High Speed Die Bonder Video

Trade Show News

Blog Insights

Volume XXXIX

Manufacturing Automation Case Study-Flexible High-Speed Die Bonding Automation Platform 

Trade Show News

Blog Insights

Volume XXXVIII

MRSI Systems – “One Stop Shop” Product Demo at CIOE

Laser Focus World: Challenges for photonics manufacturing in the new data center era

Trade Show News

Volume XXXVII

MRSI Systems is Acquired by Mycronic AB

Trade Show News

Blog Insights

Volume XXXVI

Challenges in Die Bonding of Gallium Nitride High Power Devices

Customer Support and Training Programs

Scale with Us

Trade Show News

Blog Insights

Volume XXXV

Building Complex Hybrid Circuits-Advanced Packaging

Trade Show News

Blog Insights

Volume XXXIV

MRSI Systems Launches New Software Video Training Programs

Trade Show News – Visit MRSI at OFC in San Diego March 11-15

MRSI-M3 Epoxy Stamping Video

Blog Highlights

Volume XXXIII

New Product Spotlight MRSI-HVM3

New Website Process Pages

Trade Show News – Visit MRSI at OFC in San Diego March 11-15

Webinar New Insights – Watch the MRSI Webinar: The Challenges in High Volume Manufacturing of
Photonic Devices for Data Center Applications

Volume XXXII

MRSI Systems – IEEE Tech Insider Webinar January 25th: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications

High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions – Chinese Version

MRSI Systems’ Story

Visit MRSI in San Francisco – SPIE Photonics West

MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

2017

Volume XXXI

Best Holiday Wishes from MRSI Systems

Watch the MRSI-705, 5 Micron Die Bonder Video

MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

Volume XXX

MRSI Systems Receives Funding from State of Massachusetts for Advanced Manufacturing Initiative 

High Volume Manufacturing of Photonic Devices: Assembly Starts with Design

MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

Volume XXIX

Assembly Solutions

Visit MRSI Systems at Productronica in Munich, Germany

MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

Volume XXVIII

MRSI is Sponsoring IMAPS 2017 — Raleigh, IMAPS 50th Anniversary Symposium

Visit MRSI at Productronica

CIOE – Big Success with Introduction of MRSI-HVM3

Volume XXVII

MRSI to Exhibit at CIOE

Upcoming Events: ECOC, Sweden, September 18-20 and Electronics Packaging Symposium, NY, September 19-20

Volume XXVI

Read our Latest Article in Chip Scale Review: High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges
and solutions

Upcoming Events: China International Optoelectronic Expo September 6-9 and ECOC September 18-20

Volume XXV

MRSI Systems is Exhibiting at Semicon West

Customer Visits

MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

Volume XXIV

MRSI-M3 Die Bonder Video

MRSI Sponsors FIRST Robotics Team

Customer Visits

Volume XXIII

Case Study – MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT) 

TESAT’s challenge was to develop an “Automated Microwave Factory” to manufacture complex highly integrated LTCC microwave modules within the frequency range 2 to 77GHz, 24 hours per day including a manless overnight ghost shift

Our Chinese Website Launch

Volume XXII

Our latest blog post: Challenges in Die Bonding of Gallium Nitride High Power Devices

Gallium Nitride (GaN) materials have long been regarded as great alternatives and enhancements to GaAs and silicon-based counterparts for applications demanding high power and high frequency performance

Upcoming Conferences

Volume XXI

Our latest blog post: High Volume Manufacturing of Photonic Components and Modules.

In this post we discuss: Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices.

2016 

Volume XX

Best Holiday Wishes from MRSI Systems

We wish you a very Happy Holiday season and a peaceful and prosperous New Year.

High Volume Manufacturing (HVM) of Chip on Submount (CoS)

Volume XIX

New Website Launch

This month we launched our new website to celebrate our product family, share some great new technical content, and introduce you to our team.

Volume XVIII

Advance Eutectic Packaging for Volume Manufacturing of Photonic, Microwave and RF Electronics

Eutectic bonding is an area of particular interest in photonics, microwave and RF electronics, due to the need for a clean, highly thermally efficient process and for long-term reliability.

Volume XVII

MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet

MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet in Silicon Valley for Fast Prototyping and New Product Introduction.

Volume XVI

Die Bonding with Integrated In Situ UV Curing

One challenge in building photonic devices such as Active Optical Cables (AOC) is to ensure extremely accurate post die bond positioning of lenses or other critical devices.

Volume XV

Automated Material Traceability

Material traceability information is important for automotive components, medical devices, government contracts, aerospace & defense electronics and advanced manufacturing systems.

2015 

Volume XIV

Best Holiday Wishes

We wish you a happy holiday season and a peaceful and prosperous New Year.

Volume XIII

Device Flipping Mechanisms & Eutectic Stages & TO Can Package

Certain devices, especially optical parts, require a 90 degree change in orientation after pick up.

Volume XII

Achieving Accurate Global and Local Alignments

Having a proven ultra-accurate machine platform that is mechanically and thermally stable, with no cantilevered parts, is a baseline to achieve accurate device placement.

Volume XI

Automatic In-line Eutectic Die Bonding

Applications, such as RF Power devices, require high speed solutions which include automated in-line material handling with integrated eutectic die attach capability.

Volume X

Handling Large Aspect Ratio, Thin, Delicate Die

Many applications including RF Power, Optical and MEMS require large, thin, high aspect ratio devices. Aspect ratios can exceed 45 to 1.

Volume IX

AOC Die Bonder Integrated with In Situ Light Measurement

One challenge in building photonic devices, such as Active Optical Cables (AOC), is to ensure proper light coupling as early in the manufacturing process as possible.

Volume VIII

MRSI Sponsors First Robotics Team

FIRST® is an international not-for-profit organization founded by inventor Dean Kamen to inspire young people’s interest and participation in science, technology, engineering, and math).

Volume VII

MRSI Expands Customer Support Organization

To meet the demand of our rapidly expanding business, MRSI has been building up our customer support organization that is managed by Peter Cronin.

2014 

December 2014

Die Bonding of Silicon Photonic Devices

Silicon photonics is an evolving technology in which data is transferred via light. Photons can carry far more data in less time than electrons providing scalable solutions for expanding data communication needs worldwide.

October 2014

Precision Dispensing of Conductive Epoxy

MRSI Systems, a leading manufacturer of dispense and assembly equipment for semiconductor and photonic packaging, is now offering its industry leading MRSI-175Ag with a Rotary Style Positive Displacement Pump with a new higher resolution motor….

July 2014

MRSI Systems now offers its flagship MRSI-M3 Assembly Work Cell configured to 1-micron placement accuracy!

MRSI Systems, a leading manufacturer of semiconductor and optical assembly systems, is now offering its well-established M3 work cell with 1 micron placement accuracy…

May 2014

MRSI Systems Announces 2.5D/3D Thermo Compression Bonder

MRSI Systems has been in development of an automated system and processes for thermo compression bonding that enables new methods of assembling semiconductor devices…

April 2014

Active Optical Cables (AOC) Assembly

Active Optical Cables (AOC) technology is a cabling methodology that accepts the same electrical input as traditional copper cables, but utilizes optical fiber between the connectors…

January 27th 2014

MRSI Systems Acquisition is Completed

Today, we announce some exciting news as we enter the next chapter of our successful thirty year long history. The acquisition from Newport Corporation of MRSI Systems, a company established by the existing management team, is completed as of January 24, 2014…

January 10th 2014

Fast Ramp Eutectic Die Attach

Our systems are considered the industry standard for eutectic bonding. This capability includes the addition of a eutectic reflow station with fast temperature ramping capability…

2013

November 2013

Newport to Sell All Shares of MRSI to a Team of Current Management

MRSI was founded in 1984 and has remained focused on providing our customers with the highest quality services and solutions. On January 23, 2002 MRSI announced an agreement to be acquired by Newport Corporation…

October 2013

Servo Drive of Needle Mechanism Synchronized with Pick Up Collet

Thin die handling has become a common need among customers building high performance packages. MRSI is known as a leader in the industry for handling thin die…

August 2013

Real Time Video Provides Process Monitoring for Dispense and Assembly:

Real time video is available to monitor the dispense and assembly process on the Newport MRSI family of Dispense and Die Bonders…

July 2013

Applications Corner

The MRSI-705 Assembly Workcell continues to set new industry standards for ultra-precise, high-speed component assembly…

June 2013

The Importance of Proper Lighting

Lighting is an important component of any vision recognition system. When it comes to lighting it is not a case of “one size fits all”…

May 2013

Dispensing Solutions Update

MRSI Systems has been busy adding new dispense features to the MRSI-175Ag Precision Dispense System and the dispensing options on our family of die bonders…