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Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 40+ years of experience in the industry in tandem with our 24/7 reliable field operations.
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History
Service & support
Why do customer's choose MRSI?
Career
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High precision flip-chip die bonders
Submicron Die Bonders
1 Micron Die Bonders
1.5 Micron Die Bonders
3 Micron Die Bonders
5 Micron Die Bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners - MRSI-A-L
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Prototyping
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MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
Visit page Products
High precision flip-chip die bonders
Submicron Die Bonders
1 Micron Die Bonders
1.5 Micron Die Bonders
3 Micron Die Bonders
5 Micron Die Bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners - MRSI-A-L
Prototyping and training services
Prototyping
MRSI Systems Training Services
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Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
TO-TOSA/ROSA
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Wafer Level Packaging
Applications
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Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
TO-TOSA/ROSA
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Wafer Level Packaging
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Die bonding
Eutectic die bonding
Epoxy die bonding
Processes
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Die bonding
Eutectic die bonding
Epoxy die bonding
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Mycronic Global
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News & events
Press releases
Press releases
30 9月 2024, 19:00
MRSI Mycronic introduces next generation high precision epoxy dispenser for advanced packaging
4 9月 2024, 15:00
MRSI Mycronic to Showcase Advanced Assembly Solutions for High Volume Photonics Manufacturing at CIOE 2024
19 3月 2024, 20:00
新机发布|MRSI(Mycronic集团)发布创新MRSI-A-L耦合设备,引领精密光学组件封装新纪元
12 3月 2024, 15:00
MRSI introduces innovative MRSI-A-L Active Aligner for optical packaging solutions
5 9月 2023, 15:15
MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging
21 8月 2023, 21:15
MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023
9 8月 2023, 15:00
MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023
10 7月 2023, 15:00
MRSI to exhibit with live demonstrations and present at LASER World of PHOTONICS CHINA
13 9月 2022, 11:46
MRSI launches new die bonders with improved accuracy
22 8月 2022, 12:05
MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder
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2024/12/27 8:44:30