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Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 40+ years of experience in the industry in tandem with our 24/7 reliable field operations.
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Why do customer's choose MRSI?
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High precision flip-chip die bonders
Submicron Die Bonders
1 Micron Die Bonders
1.5 Micron Die Bonders
3 Micron Die Bonders
5 Micron Die Bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners - MRSI-A-L
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MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
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High precision flip-chip die bonders
Submicron Die Bonders
1 Micron Die Bonders
1.5 Micron Die Bonders
3 Micron Die Bonders
5 Micron Die Bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners - MRSI-A-L
Prototyping and training services
Prototyping
MRSI Systems Training Services
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Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
TO-TOSA/ROSA
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RF Power Amplifier & Microwave Device
Microelectronics
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Wafer Level Packaging
Applications
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Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
TO-TOSA/ROSA
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Wafer Level Packaging
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Die bonding
Eutectic die bonding
Epoxy die bonding
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Die bonding
Eutectic die bonding
Epoxy die bonding
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Mycronic Global
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High precision flip-chip die bonders
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High Precision Flip-chip Die Bonders
Submicron flip-chip die bonders
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1 micron flip-chip die bonders
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1.5 micron flip-chip die bonders
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3 micron flip-chip die bonders
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5 micron flip-chip die bonders
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2024/12/22 2:14:59
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