The next generation MRSI-175Ag Epoxy Dispenser handles the most demanding dispensing applications such as advanced packaging, microwave modules, optical modules, hybrid circuits, multichip modules, and semiconductor packaging. With the ability to operate two heads in tandem, the MRSI-175Ag provides unparalleled process control and comprehensive dispensing capability. Die attach, underfill, encapsulation, and multi-pin stamping are all supported on this flexible dispensing platform.

The MRSI-175Ag Epoxy Dispenser is a high-performance model offered by MRSI Systems. It is a pneumatic dual epoxy dispenser. This type of dispensing system is known for its speed and precision, making it a popular choice in industrial settings. This model is specifically designed for dispensing silver-filled epoxies, making it ideal for use in electronics and other applications where a high-conductivity epoxy is required. In addition to its pneumatic dual head design, it also features a controlled volume dispensing system proven to be highly repeatable, fast and accurate.

The MRSI-175Ag is a servo-controlled X, Y, and Z dispensing platform. The machines' two dispensing heads can be individually configured with various pump types, such as positive displacement, time/pressure, and jetting. A stamp head is also available with the capability to repeatedly stamp dots as small as 0.1mm. Dots of silver-filled conductive epoxy of 0.2mm diameter are quickly and routinely dispensed by the system; a requirement frequently encountered for the assembly of microwave modules, as well as other advanced packages. Precise epoxy flow control is necessary to meet tight bond line thickness specifications while achieving 100% area coverage.

Driven by MRSI Systems’ Windows software, the MRSI-175Ag delivers a clean, easy-to-use interface, providing easy access to extensive process control functions, as well as product programming capabilities. The software is common to all MRSI Systems’ machines.

MRSI-175Ag+ is an available option with 10µm accuracy.

Benefits

As with all other MRSI platform offerings, the  next generation MRSI-175Ag is built to last. Flexibility is built-in, with the ability to dispense two different materials, with different dispensing parameters, on any given application. Attention is given to automation, reducing operator intervention and machine downtime. Adding an MRSI-175Ag epoxy dispenser to your existing manufacturing line upstream from an MRSI-M3 3-Micron Die Bonder or an MRSI-705, increases line efficiency and throughputs with a minimum investment.

Advanced functionality equates to significant operational and financial benefits:

• Increase capacity at lower cost – Separating the dispensing process step from the placement operation translates into lower costs by leveraging both machine types for what they do best.
• Less Labor Cost – Automatic needle cleaning, automatic calibration routines mean less operator intervention and higher productivity.
• Lower Cost of Ownership – Commonality with MRSI placement machines means lower spare parts cost, lower parts inventory, lower training costs.
• Higher Yields – High precision, automated process control functions, proven pump technology all come together to ensure maximum yields, which in turn translates into a lower cost per part.
• Flexibility – Handle whatever comes your way with the ability to use the right pump for the right application. Reconfigure if needed.
• More Energy Efficient – 35% more energy efficient compared to previous generations.
• Ergonomic – Easier to operate and access key areas.  
• Ultra-high speed – Up to 10x faster than previous generation.
• Accuracy – 25µm standard, 10µm option available.

The base MRSI-175Ag comes already equipped with industry-leading functionality. Additional capability is available to reflect specific application needs.