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Manual flying probe for PCB test
A5 Neo
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Automated flying probe for PCB test
A7a Pro
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Flying ahead in Michigan with Calumet
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atg Luther & Maelzer GmbH (HQ)
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High precision flip-chip die bonders
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Active Aligners - MRSI-A-L
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MRSI Automation (Shenzhen) Co., Ltd.
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Photonic Interconnects
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Axxon
Product areas
Mycronic is a global high-tech company that develops, manufactures and markets production equipment that meets the electronics industry’s high demands for precision, flexibility and efficiency.
Visit page Product areas
PCB assembly
Products
SMT assembly
Stencil printing
MYPro S20
MYPro S30
Jet printing
MY700JP
MY700JX
MY700JD
Solder paste inspection
PI Pico - 3D SPI
PI Primo - 3D SPI
Component placement
MYPro A40DX
MYPro A40SX
MYPro A40LX
MY300SX
MY300LX
MY300HX
MY300EX
Automated optical inspection
MYPro I50
MYPro I50X
MYPro I51
MYPro I81
MYPro I91
Component storage
MYTower 5
MYTower 6
MYTower 6+
MYTower 7+
MYTower 5x
MYTower 6x
Process software
MYPro Link
MYPro Connect
MYCenter Analysis
Dispensing and coating
Tabletop dispensing
MYT50
MYT10
In-line dispensing
MYD50
MYD10
MY700JD
Dispensing valves
Industrial dispensing
MYC60
Conformal coating
MYC10
MYC50
Conformal coating valves
I70X
Solutions
PCB assembly solutions
Case stories
Webinars and events
Webinars
Live events
News and press releases
News
Press releases
About us
MYNews magazine
Photomask equipment
Products
Display mask writer
Semiconductor mask writer
Multi-purpose mask writer
Display mask metrology system
Semiconductor mask metrology system
About us
Solutions
Large area measurement
LCD displays
Smartphone displays
News
More virtual interactions, and the rise of a metaverse
Service & support
Career
Why work at Mycronic?
Meet your new colleagues
Who are we?
Student opportunities
Contact us
Mycronic Sweden HQ
Bare board testing
About us
History
Products
Manual flying probe for PCB test
A5 Neo
A7 Pro
A7-16 Pro
A7XW Pro
A9
A9 plus
Automated flying probe for PCB test
A7a Pro
A9a
A9aL
A9a plus
Flying probe for substrate test
S2-8 / S2-8 plus
S2-16 / S2-16 plus
S3
S3-8
Fixture based test systems
LM1000
Services
Bareboard spare parts, consumables & accessories
Service solutions Bareboard testing
Solutions
Flying ahead in Michigan with Calumet
News & events
All news
Events
TPCA 2024
HKPCA 2024
Career
About us at Bareboard testing
Apprenticeship program
Job advertisements
Reinigungsfachkraft (m/w/d)
Mechatroniker (m/w/d)
Contact
atg Luther & Maelzer GmbH (HQ)
Die bonding solutions
About us
History
Service & support
Why do customer's choose MRSI?
Career
Partners
Testimonials
Products
High precision flip-chip die bonders
Submicron Die Bonders
1 Micron Die Bonders
1.5 Micron Die Bonders
3 Micron Die Bonders
5 Micron Die Bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners - MRSI-A-L
Prototyping and training services
Prototyping
MRSI Systems Training Services
Applications
Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
TO-TOSA/ROSA
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Processes
Die bonding
Eutectic die bonding
Epoxy die bonding
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Events
Webinars
Press releases
News
Cases
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Video gallery
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Photonic Interconnects
Dispensing and coating
Axxon
About us
Always one micrometer ahead
Key facts about Mycronic
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Key area: Innovation for sustainability
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Mycronic is a world-leading provider of flexible, high-precision production solutions for electronics manufacturing. We strive to keep our customers at the forefront of the industry by offering innovative, sustainable, high-quality production solutions with long product life cycles – solutions designed around the people who use them.
Visit page About us
Always one micrometer ahead
Key facts about Mycronic
Strategy
History
Purpose & vision
Expertise & innovation
Organization
Sustainability
Our sustainability commitment and goals
Our sustainability impact
Key area: Innovation for sustainability
Key area: Future engineers through diversity
Key area: Climate impact
Responsible business practices
WEEE
Policies
Code of Conduct
Distributor Code of Conduct
Supplier Code of Conduct
Supplier Code of Conduct for Service Providers and non-critical Suppliers
Quality & environmental policy
Diversity, equity & inclusion policy
Health & safety policy
Anti-corruption policy
Whistleblower policy
Certificates
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Mycronic as an investment
Mycronic share
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Capital markets day 2022
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Through focus on innovation and organic growth, together with an active acquisition strategy and healthy profit contributions from all divisions, Mycronic is well-placed to continue its growth journey.
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Mycronic as an investment
Mycronic share
Information about the share
Key ratios Mycronic
Shareholders
Insiders
Subscribe to IR news
Consensus Estimates
Financial & sustainability targets
Financial reports
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Capital markets day
Capital markets day 2022
Governance
Framework for corporate governance
Board of directors
Executive management team
Remuneration to the CEO
Auditor
Committees
Nomination committee
Audit committee
Remuneration committee
Annual general meeting
Contact Investor Relations
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Think of the most high-tech electronics products you can imagine. Then think one step further. What technology creates the most advanced high-tech of today? Ours do.
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Mycronic Sweden HQ
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Axxon China
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Visit our contact page for contact details for our sales and support departments.
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Mycronic Sweden HQ
Mycronic Benelux
Mycronic China
Mycronic France
Mycronic Germany
Mycronic atg Luther & Maelzer GmbH (HQ)
Mycronic Vanguard Automation GmbH
Mycronic Japan Fukuoka
Mycronic Japan
Mycronic Singapore
Mycronic South Korea
Mycronic UK
Mycronic USA
Axxon China
MRSI USA
Mycronic Saint-Egrève
Mycronic Vietnam
Mycronic Mexico
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News & events
Our events
Upcoming Events
Past Events
November 20 - November 21
Online
Automotive LIDAR 2024
7th Annual Conference and Exhibition. MRSI Mycronic will be presenting.
Die bonding
United States of America
English
December 4, 08:00 - December 6, 18:00
at Shenzhen World Convention & Exhibition Center (Baoan), Shenzhen
HKPCA 2024
Bare board testing
China
English
January 21, 2025 - January 23, 2025
Santa Clara, CA USA
Chiplet Summit 2025
MRSI Mycronic is sponsoring the Chiplet Summit at the Santa Clara Convention Center. Booth #314
Die bonding
United States of America
English
January 28, 2025 - January 30, 2025
San Francisco, CA USA
SPIE Photonics West 2025
Photonics West is the world’s premier event for lasers, biomedical optics, biophotonics, quantum, and optoelectronics. Booth: #5407
Die bonding
United States of America
English
February 26, 2025 - February 28, 2025
Marina Bay Sands Singapore
Asia Photonics Expo 2025
MRSI Mycronic will exhibit at the Asia Photonics Expo 2025.
Die bonding
Singapore
English
March 3, 2025 - March 6, 2025
Phoeniz, AZ, USA
IMAPS Device Packaging Conference 2025
The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6, 2025.
Die bonding
United States of America
English
March 11, 2025 - March 13, 2025
Shanghai New International Expo Centre (SNIEC)
LASER World of PHOTONICS CHINA 2025
Asia’s largest trade fair for the photonics industry in Shanghai New International Expo Centre (SNIEC). Booth #N1.1202.
Die bonding
China
Chinese
April 1, 2025 - April 3, 2025
San Francisco, CA USA
OFC 2025
OFC is the world's largest event for optical networking and communications. MRSI Mycronic Booth: #3218
Die bonding
United States of America
English
April 9, 2025
Filderhalle Leinfelden-Echterdingen
EPP InnovationsFORUM⁺ 2025
Mycronic is attending the 2025 year edition of EPP InnovationsFORUM⁺
PCB Assembly
Germany
German
May 6, 2025
Boxborough, MA, USA
IMAPS New England 2025
International Microelectronics Assembly and Packaging Society (IMAPS) New England 51st Symposium & Expo.
Die bonding
United States of America
English
June 17, 2025 - June 19, 2025
San Francisco, CA
IMS - International Microwave Symposium 2025
IMS is focused on the microwave industry. MRSI Booth: #1629
Die bonding
United States of America
English
June 18, 2025 - June 21, 2025
Bangkok, Thailand
Nepcon Thailand 2025
MRSI Mycronic will exhibit at Nepcon Thailand 2025.
Die bonding
Singapore
English
September 10, 2025 - September 12, 2025
Shenzhen, China
CIOE – China International Optoelectronic Expo 2025
CIOE is the world’s largest optoelectronics event. Location: Shenzhen World Convention & Exhibition Center Shenzhen, China.
Die bonding
China
English
September 29, 2025 - October 1, 2025
Copenhagen, Denmark
ECOC 2025
The ECOC Exhibition is the key meeting place for everyone in the fibre optic communication technology industry. Booth: #C4315
Die bonding
Denmark
English
October 7, 2025 - October 9, 2025
Phoeniz, AZ USA
SEMICON West 2025
SEMICON West includes the extended microelectronics industry supply chain. Booth: #6268
Die bonding
United States of America
English
11/21/2024 6:29:52 AM