5G technology fuels connectivity and innovation

“Right now, we’re seeing the first waves of 5G devices hitting the market,” says Ivan Li, Sr VP of Mycronic’s Assembly Solutions High Volume division.

“They use a high-band spectrum that offers faster connectivity, ultra-low latency and the ability to handle a lot more data.” 

5G investments are accelerating

He explains that latency is the lag time in the transmission that can disrupt the user experience – whether it’s for advanced gaming, streaming of videos, e-health, or connected vehicles. Now, with greater transmission speeds, 5G networks will dramatically enhance the experience. And while the rollout of 5G mobile networks has been slightly delayed due to COVID-19, the ramp-up in investments is accelerating.

5G will form the backbone for future technology innovation, including the 3D Metaverse.

Ivan Li, Sr VP of Mycronic’s Assembly Solutions High Volume division

“In my view, 5G is the technology leap that will form the backbone for future technology innovation, including the 3D Metaverse. It’s real and it’s happening now!” he says.

5G connects us around the globe

High-volume dispensing & protective coatings

From his front-row position in the electronics hub of Shenzhen, China, Mr. Li and his team are in a unique position to see the manufacturing challenges of 5G playing out in real-time.

“For consumer electronics, the challenge is to create robust, well-protected smartphones, wearables, and devices. Here is where Mycronic’s fully automated high-volume dispensing and protective coating equipment is being widely adopted by leading manufacturers,” he says.

“For consumer electronics, the challenge is to create robust, well-protected smartphones and wearable devices – which is where high-speed dispensing and protective coating equipment comes in.”  

“But this is not all,” says Ivan Li. “Suppliers of infrastructure like 5G radio base stations, switches and routers must also be able to mount layers of advanced components on complex printed circuit boards. This may require full-line SMT solutions, including jet printers and specially tailored dispensing solutions.” 

Die bonding and electrical PCB testing

Finally, he notes that Mycronic’s Global Technologies division is developing crucial die bonding solutions for 5G network components as well as electrical tests for the bare board PCBs used.  

“5G rollout across the globe continues to demand that manufacturers produce smaller and smaller products, with higher speed and bandwidth,” says Mr Li.

“The 5G technology requires high-performance optical devices such as transceivers (a device that combines a transmitter of data and a receiver of data) embedded in datacenters to allow data to flow in and out at maximum speeds.” 

Handling miniaturization with accuracy and speed Ivan Li points to exciting new developments at Mycronic’s MRSI unit (part of Global Technologies division), which provides cutting-edge die bonding equipment for customers manufacturing such optical devices.

“MRSI's die-bonders help them overcome significant challenges to deliver increasingly smaller packaging housing with smaller dies (chips) with higher density,” he concludes.

Key trends shaping the future

NOTE: This is the second of seven articles on key trends shaping the future
of the electronics industry – and how to capitalize on them.