Die bonding solutions

Our solutions help our customers to enable high throughput production, just-in-time supply, and fast-pace innovations of critical photonic components for high growth market segments such as hyper-scale data centers, 5G wireless, LiDAR, VR/AR. Product configurations address specific application needs such as high-power laser diodes and multi-die TO products such as WDM & EML-TOs, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products.

MRSI A-L is a modular–design machine, with integrated pick and place, dispense, vision, alignment functions, as well as intelligent software that offers users flexible processes. It is a powerful tool for optical components assembly, such as transceivers, silicon photonics, AWGs, LiDAR, integrated optics etc.

The next generation MRSI-175Ag Epoxy Dispenser handles the most demanding dispensing applications such as advanced packaging, microwave modules, optical modules, hybrid circuits, multichip modules, and semiconductor packaging. With the ability to operate two heads in tandem, the MRSI-175Ag provides unparalleled process control and comprehensive dispensing capability. Die attach, underfill, encapsulation, and multi-pin stamping are all supported on this flexible dispensing platform.

MRSI offers a comprehensive set of prototyping and training services. Led by experienced engineers, the programs are tailored to suit each customer’s needs, including concepts of robot orientation, teaching alignments, the die bonding process and production set up.