Applications
Photonics
MRSI Systems has been a leading supplier to manufacturers of advanced optical assembly for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies required to successfully produce photonic integrated circuits (PIC). In recent years, the advantage of transferring data with photons instead of electrons, has become a widely accepted methodology for solving the packaging challenges resulting from our growing demand for data and our insatiable appetite for bandwidth.
Microwave & RF
MRSI Systems has been a leading supplier to manufacturers of High Frequency, Ultra High Frequency components for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies required to successfully produce RF and Microwave modules. In recent years, the use of Radio Frequency ICs has continued to rise, fueled by the need for high switching speeds, higher performance power amplifiers and growth in optical networks.
Microelectronics
MRSI Systems has been a leading supplier to assembly houses and OEMs involved with hybrid assembly for more than 30 years. For such assemblers, machine requirements vary greatly from one job to another. Consequently, customers look for a platform machine that offers maximum flexibility when it comes to range of components and substrates handled, die presentation schemes, and process-related capabilities.
Sensors
The photonics sensor and detectors market is growing rapidly, which encourages application of photonics sensor technology into several industries areas such as manufacturing, defence & aerospace, energy, information technology, communication, medical & healthcare and others. Without the use of photonics sensor and detector technology, the complexities of physical, biological and chemical systems are not feasible.
Wafer Level Packaging
As the semiconductor industry propels into an era of unprecedented advancement and growth, advanced packaging solutions through wafer-level packaging stand to support record-breaking demand. Wafer-level packaging (WLP) has been growing continuously in electronics packaging due to its low cost in batch manufacturing. Wafer-level packaging is a process where electronic components such as a chip, memory, BGA, and other dies are attached to the wafer directly.