Innovation Continues on MRSI-705HF

MRSI Mycronic to Present at the 7th Annual Automotive LIDAR Conference

Meet the MRSI-705: Your Essential Tool for Precision and Reliability in Critical Applications

The MRSI-705 has established itself as a reliable tool in the aerospace, defense, and medical industries, playing a crucial role in mission-critical tasks due to its performance, adaptability, and dependability.

MRSI Support for Application Specific Pickup Tip Designs

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks, expanding the number of tools that are stored on the machine at one time. 

Advanced Patented Tool Change Turret from MRSI: Revolutionizing Precision Technology

MRSI’s die bonding systems are designed to address the challenges of chip packaging with a focus on efficiency, precision, and productivity. These systems feature an advanced, patented tool-changing turret that enhances operational efficiency.

MRSI Mycronic introduces next generation high precision epoxy dispenser for advanced packaging

MRSI Mycronic a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding, active alignment, and epoxy dispensing systems, proudly introduces the next generation high precision MRSI-175Ag epoxy dispenser. This latest innovation is a significant improvement in MRSI’s epoxy dispensing solutions focusing on speed, accuracy, safety, and ergonomics.

Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Mycronic and General Manager of MRSI Automation (Shenzhen) Co., Ltd., Shenzhen, China will present “Gen AI: Catalyst for Optical Module Innovation” on Thursday, September 26th.

Join us at IMAPS in Boston!

MRSI Mycronic is exhibiting at the 57th International Symposium on Microelectronics from October 1-2, 2024, in Boston, MA. The event will take place at the Encore Boston Harbor from October 1-3, 2024, and will feature 5 technical tracks and an Interactive Poster Session.

Join MRSI at the 50th European Conference on Optical Communication

We are pleased to be exhibiting again this year at the 50th ECOC in Frankfurt am Main, Germany.

MRSI Mycronic to Showcase Advanced Assembly Solutions for High Volume Photonics Manufacturing at CIOE 2024

MRSI Mycronic, a part of the Mycronic Group, will be exhibiting and presenting innovative advanced assembly solutions at the 24th China International Optoelectronic Exposition (CIOE) from September 11-13, 2024, at the Shenzhen World Exhibition and Convention Center. As an industry leader for over 40 years, MRSI Mycronic will showcase our family of die bonders and active aligners designed for precision, speed, and reliability that meet the evolving needs of key markets. For example, the rapid deployment of AI clusters demands higher speed optical interconnects that must be packaged using higher accuracy techniques for both single-mode and multi-mode transceivers in high volume manufacturing. MRSI’s new active aligners (MRSI-A-L) and 1-micron die bonders (MRSI-H1/HVM1) meet this challenge perfectly, for all the processes a customer might employ. Please visit our booth to learn about our latest products and applications. MRSI’s technical experts will be on site to discuss your application requirements in-depth.

Dr. Limin Zhou to present at the 22nd Infostone Optical Communication and Market Technology Conference (IFOC 2024)

Mark your calendars for September 9-10, 2024, at the InterContinental Hotel of the Shenzhen World Exhibition and Convention Center in Shenzhen, China, which hosts the highly anticipated Infostone Optical Communication and Market Technology Conference. This year’s conference promises to be a hub of innovation and insight, focusing on cutting-edge trends and technologies shaping the future of the industry.

Join MRSI Mycronic at the China International Optoelectronic Exposition (CIOE)

MRSI is proud to be exhibiting and presenting at the 25th China International Optoelectronic Exposition this year in Shenzhen. Stop by our booth #10B79 to learn more about how MRSI products meet all optical transceiver bonding and attach needs. We will showcase our latest die bonding, active alignment, and dispensing solutions.

Mastering the Art of Handling Delicate High Aspect Ratio Dies: Challenges and Solutions

Handling delicate, large aspect ratio, and thin dies is essential across various applications, including RF Power, Optical, and MEMS. These devices have aspect ratios exceeding 45 to 1, presenting unique challenges.

The High-Performance and Flexible MRSI A-L for Optical Assembly

The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner – a high-performance and flexible solution for manufacturing transceivers, AWGs, LiDAR, silicon photonics, integrated optics, and more.

MRSI shines at May events: showcased and featured

In the bustling world of technology, May was a month marked by significant events, and MRSI was at the forefront. With appearances at IMAPS New England in Boxborough, MA, and the 2024 Semiconductor Advanced Technology Innovation Development and Opportunities Conference in Suzhou, China, we showcased our advanced technology.