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Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 40+ years of experience in the industry in tandem with our 24/7 reliable field operations.
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History
Service & support
Why do customer's choose MRSI?
Career
Partners
Testimonials
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High precision flip-chip die bonders
Submicron Die Bonders
1 Micron Die Bonders
1.5 Micron Die Bonders
3 Micron Die Bonders
5 Micron Die Bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners - MRSI-A-L
Prototyping and training services
Prototyping
MRSI Systems Training Services
Products
MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
Visit page Products
High precision flip-chip die bonders
Submicron Die Bonders
1 Micron Die Bonders
1.5 Micron Die Bonders
3 Micron Die Bonders
5 Micron Die Bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners - MRSI-A-L
Prototyping and training services
Prototyping
MRSI Systems Training Services
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Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
TO-TOSA/ROSA
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Applications
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Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
TO-TOSA/ROSA
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Processes
Die bonding
Eutectic die bonding
Epoxy die bonding
Processes
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Die bonding
Eutectic die bonding
Epoxy die bonding
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News & events
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
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Visit our contact page for contact details for our sales and support departments.
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Mycronic Global
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Events
Upcoming Events
Past Events
January 21, 2025 - January 23, 2025
Santa Clara, CA USA
Chiplet Summit 2025
MRSI Mycronic is sponsoring the Chiplet Summit at the Santa Clara Convention Center. Booth #314
Die bonding
United States of America
English
January 28, 2025 - January 30, 2025
San Francisco, CA USA
SPIE Photonics West 2025
Photonics West is the world’s premier event for lasers, biomedical optics, biophotonics, quantum, and optoelectronics. Booth: #5407
Die bonding
United States of America
English
February 26, 2025 - February 28, 2025
Marina Bay Sands Singapore
Asia Photonics Expo 2025
MRSI Mycronic will exhibit at the Asia Photonics Expo 2025.
Die bonding
Singapore
English
March 3, 2025 - March 6, 2025
Phoeniz, AZ, USA
IMAPS Device Packaging Conference 2025
The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6, 2025.
Die bonding
United States of America
English
March 11, 2025 - March 13, 2025
Shanghai New International Expo Centre (SNIEC)
LASER World of PHOTONICS CHINA 2025
Asia’s largest trade fair for the photonics industry in Shanghai New International Expo Centre (SNIEC). Booth #N1.1202.
Die bonding
China
Chinese
April 1, 2025 - April 3, 2025
San Francisco, CA USA
OFC 2025
OFC is the world's largest event for optical networking and communications. MRSI Mycronic Booth: #3218
Die bonding
United States of America
English
May 6, 2025
Boxborough, MA, USA
IMAPS New England 2025
International Microelectronics Assembly and Packaging Society (IMAPS) New England 51st Symposium & Expo.
Die bonding
United States of America
English
June 17, 2025 - June 19, 2025
San Francisco, CA
IMS - International Microwave Symposium 2025
IMS is focused on the microwave industry. MRSI Booth: #1629
Die bonding
United States of America
English
June 18, 2025 - June 21, 2025
Bangkok, Thailand
Nepcon Thailand 2025
MRSI Mycronic will exhibit at Nepcon Thailand 2025.
Die bonding
Singapore
English
September 10, 2025 - September 12, 2025
Shenzhen, China
CIOE – China International Optoelectronic Expo 2025
CIOE is the world’s largest optoelectronics event. Location: Shenzhen World Convention & Exhibition Center Shenzhen, China.
Die bonding
China
English
September 29, 2025 - October 1, 2025
Copenhagen, Denmark
ECOC 2025
The ECOC Exhibition is the key meeting place for everyone in the fibre optic communication technology industry. Booth: #C4315
Die bonding
Denmark
English
October 7, 2025 - October 9, 2025
Phoeniz, AZ USA
SEMICON West 2025
SEMICON West includes the extended microelectronics industry supply chain. Booth: #6268
Die bonding
United States of America
English
11/21/2024 11:40:10 PM