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Wafer-Level Packaging Symposium 2025

The Wafer-Level Packaging Symposium will be held in San Francisco, CA from February 18-20, 2025.

February 18 - February 20
San Francisco, CA, USA
Die bonding
United States of America
English
Wafer-Level Packaging Symposium

The Wafer-Level Packaging Symposium will bring together the semiconductor industry’s most respected authorities to address all aspects of wafer-level, 3D device packaging, advanced manufacturing & test technologies.

Expo Dates: February 19-20, 2025.