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Pulse heating fast ramping eutectic stage

Pulse heating fast ramping eutectic stage

Upward facing camera for bottom die feature alignment

Linear flux well for flip chip

UV dispense and cure of lenses

Wafer adaptor ring

Wafer picking of large aspect ratio devices

Large flexible work area with wafer, tape and reel, and waffle pack input (1)

Large flexible work area with wafer, tape and reel, and waffle pack input (2)

Epoxy stamping well

Large flexible work area with wafer and waffle pack inputs and conveyor output

Large configurable work area

MRSI-705 with 6 tool banks and 78 tools total

MRSI-M3 tip over die

MRSI-705 Theta axis

MRSI-705 Upward facing camera and system standard

Pick from wafer

Tip over wafer

Two wafer option on MRSI-705 die bonder

Active Optical Cable (AOC) assembly

Needle cleaning

MRSI-M3 tip over package

MRSI-M3 multiple waffle packs

MRSI-HVM dual wafer table holding wafer, waffle pack, Gel-Pak® on wafer table adaptor