News

Join us at the upcoming events!

MRSI Mycronic will be participating in several optical and device packaging exhibitions. We invite you to attend these upcoming events. We look forward to discussing our latest product innovations with you. Discover how MRSI is advancing the future of electronics.

MRSI-A-L Active Aligner Wins Infostone 2024 Award for "Most Competitive Optical Communication Product"

On December 6, 2024, Infostone successfully held its 2024 Annual Summary and the 11th Heroes List Award live conference. Awards presented included "The Most Competitive Products of Optical Communication," "Excellent Quality Award," "Outstanding Technology Award," and "Brand Recommended Award." MRSI Mycronic's MRSI-A-L Active Aligner received the "The Most Competitive Products of Optical Communication" award from Infostone China.

Explore Innovations in Optics and Photonics at SPIE Photonics West 2025

MRSI Mycronic to Sponsor and Exhibit at the 2025 Chiplet Summit

Versatile package handling capabilities: dewar and beyond

The Next Generation MRSI-175Ag Epoxy Dispenser is now available

In the fast-paced world of advanced packaging and semiconductor manufacturing, precision and efficiency are paramount.

Innovation Continues on MRSI-705HF

MRSI Mycronic to Present at the 7th Annual Automotive LIDAR Conference

Meet the MRSI-705: Your Essential Tool for Precision and Reliability in Critical Applications

The MRSI-705 has established itself as a reliable tool in the aerospace, defense, and medical industries, playing a crucial role in mission-critical tasks due to its performance, adaptability, and dependability.

MRSI Support for Application Specific Pickup Tip Designs

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks, expanding the number of tools that are stored on the machine at one time. 

Advanced Patented Tool Change Turret from MRSI: Revolutionizing Precision Technology

MRSI’s die bonding systems are designed to address the challenges of chip packaging with a focus on efficiency, precision, and productivity. These systems feature an advanced, patented tool-changing turret that enhances operational efficiency.

Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Mycronic and General Manager of MRSI Automation (Shenzhen) Co., Ltd., Shenzhen, China will present “Gen AI: Catalyst for Optical Module Innovation” on Thursday, September 26th.

Join us at IMAPS in Boston!

MRSI Mycronic is exhibiting at the 57th International Symposium on Microelectronics from October 1-2, 2024, in Boston, MA. The event will take place at the Encore Boston Harbor from October 1-3, 2024, and will feature 5 technical tracks and an Interactive Poster Session.

Join MRSI at the 50th European Conference on Optical Communication

We are pleased to be exhibiting again this year at the 50th ECOC in Frankfurt am Main, Germany.

Dr. Limin Zhou to present at the 22nd Infostone Optical Communication and Market Technology Conference (IFOC 2024)

Mark your calendars for September 9-10, 2024, at the InterContinental Hotel of the Shenzhen World Exhibition and Convention Center in Shenzhen, China, which hosts the highly anticipated Infostone Optical Communication and Market Technology Conference. This year’s conference promises to be a hub of innovation and insight, focusing on cutting-edge trends and technologies shaping the future of the industry.

Join MRSI Mycronic at the China International Optoelectronic Exposition (CIOE)

MRSI is proud to be exhibiting and presenting at the 25th China International Optoelectronic Exposition this year in Shenzhen. Stop by our booth #10B79 to learn more about how MRSI products meet all optical transceiver bonding and attach needs. We will showcase our latest die bonding, active alignment, and dispensing solutions.

Mastering the Art of Handling Delicate High Aspect Ratio Dies: Challenges and Solutions

Handling delicate, large aspect ratio, and thin dies is essential across various applications, including RF Power, Optical, and MEMS. These devices have aspect ratios exceeding 45 to 1, presenting unique challenges.

The High-Performance and Flexible MRSI A-L for Optical Assembly

The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner – a high-performance and flexible solution for manufacturing transceivers, AWGs, LiDAR, silicon photonics, integrated optics, and more.

MRSI shines at May events: showcased and featured

In the bustling world of technology, May was a month marked by significant events, and MRSI was at the forefront. With appearances at IMAPS New England in Boxborough, MA, and the 2024 Semiconductor Advanced Technology Innovation Development and Opportunities Conference in Suzhou, China, we showcased our advanced technology.

Precision and Reliability in Defense Electronics: Exploring MRSI’s Industry-Leading Solutions

Designing and manufacturing electronic components destined for defense applications entails navigating a landscape of exacting standards. These standards demand unparalleled reliability, minimal defect rates, and compact form factors to meet the rigorous demands of the field. MRSI rises to this challenge, offering specialized die bonding solutions finely tuned for aerospace and defense requirements.

Optimizing Die Bonding with Planarity Control: Ensuring Precision in Device Attachment Across Industries

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces. Planarity control emerges as a vital tool in ensuring such accuracy.

Exploring Automotive LiDAR Packaging Trends

In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels and distinctions between LiDAR and optical transceivers.

Explore the Future of Photonics Industry with MRSI at CSC 2024 Conference

Join MRSI at the upcoming Compound Semiconductor Advanced Technology and Application Conference (CSC) taking place on May 22-23, 2024, in Suzhou, China. Dr. Limin Zhou, the General Manager of MRSI Automation (Shenzhen) Co., Ltd., and Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group), will be presenting a groundbreaking session titled “A New Engine for the Development of Photonics Industry – Generative AI.”

Advancing Microelectronics: MRSI Mycronic’s Presence at IMAPS New England

In the ever-evolving landscape of microelectronics, innovation is paramount. Positioned at the forefront of this technological revolution is MRSI and we are bringing tomorrow’s electronics to life through our assembly solutions. We will be presenting and exhibiting at the IMAPS (International Microelectronics Assembly and Packaging Society) New England Symposium on May 7th, in Boxborough, MA (Booth #406). MRSI is proud to be a Platinum Sponsor again this year.

The MRSI-H1 Family: Unleashing Precision and Agility

The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution.

Join us in March!

March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more about how MRSI is bringing tomorrow’s electronics to life.

MRSI-705HF 5 micron high force die bonder won the award for “Infostone 2023 Optical Communication Most Competitive Equipment”

On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First Suzhou Optoelectronic Technology Industry Forum. There were six awards presented: “The Most Competitive Product of Optical Communication,” “The Most Competitive Equipment of Optical Communication,” “Excellent Technology Award,” “Excellent Quality Award,” “Innovation Breakthrough Award” and “Excellent Equipment Award.”

MRSI New Solution: Tape Holder

Automotive LiDAR: Photonics assembly requirements and trends

MRSI-705HF High Force Die Bonder for power devices and advanced chip packaging