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18 JUL 2017, 21:00
NEWS
DIE BONDING SOLUTIONS

Over 450 exhibiting companies and 8,000 participants came from around the world, covering a range of industry segments, from materials, devices, components, and subsystems, as well as design and simulation software and equipment. Microwave Theory and Techniques Society (MTT-S) of the Institute of Electrical and Electronics Engineers (IEEE) organized and sponsored the international symposium.

The plenary session included a presentation “5G: Enabled by Technology, With Public Policy Assist” by Dr. Henning Schulzrinne, Chief Technologist of the US Federal Communications Commission and Professor of Computer Science at Columbia University.

The symposium highlights included technical sessions on 5G Communications Innovations, Advanced Wireless Sensors, Microwave Class-E Power Amplifiers, and High Efficiency RF Power Amplifiers. The 5G Summit included panels on “5G Startup Ecosystem – Network to Components” and “5G Test and Measurements.”

The focus session topics emphasized emerging technologies, evolving applications, and advances-

  • 5G and Beyond for the Internet of Things (IoT)
  • Latest Components for Commercial Space Applications
  • Multiscale and Multiphysics Modeling for RF, Microwave, Terahertz and Optical Applications
  • State-of-the-Art in Cryogenic Low Noise Amplifiers

Thank you to all who stopped by the MRSI booth at the International Microwave Symposium to discuss microwave RF package applications. MRSI Systems has been a leading supplier to manufacturers of High Frequency, Ultra High Frequency components for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies required to successfully produce RF and Microwave modules.

In recent years, the use of Radio Frequency ICs has continued to rise, fueled by the need for high switching speeds, higher performance power amplifiers, and growth in optical networks.

Learn more about Microwave & RF Applications