Innovation Continues on MRSI-705HF

Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications. This flexible machine is equipped with a heated bond head that can apply up to 500N of force during the bonding process, while providing heating up to 400°C from the top.  

Since launching the new machine, two new enhancements have been made including the ability to integrate JEDEC and waffle pack feeders as well as auto-tool change capability. The JEDEC and waffle pack feeders allow the MRSI-705HF machine to be automatically fed JEDEC trays and waffle packs without any manual handling. Auto-tool change enables an operator to toggle between different processes as the gripper has access to four different tools in a tool bank. One of the latest MRSI-705HF machines produced was able to change from thermocompression bonding to a UV application without manual intervention. These innovations significantly enhance throughput, making MRSI-705HF ideal for high-volume applications.