International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2017
The 50th Annual International Symposium on Microelectronics will be held October 9-12, 2017 in Raleigh, North Carolina. MRSI Systems will be exhibiting – Booth #234. There will be over 120 booths on the show room floor from October 10-11, 2017, with companies from all segments of the microelectronics industry including Military, Aerospace, Telecom/Datacom, Computing, Automotive, and Industrial. Learn more about IMAPS Raleigh 2017.
MRSI Systems – IMAPS Sponsorship
MRSI Systems has been a member and supporter of IMAPS for more than 30 years and is pleased to sponsor the exhibit lunch at the 2017 IMAPS Symposium. Please visit the MRSI Systems’ Booth (#234) to learn about our new die bonder for high volume manufacturing and our epoxy die attach solutions. Schedule a meeting with MRSI Systems at IMAPS Raleigh to learn more about MRSI Systems’ die bonders and epoxy die attach solutions. MRSI Systems has been serving optoelectronic and microelectronic customers for the past thirty-three years and understands their requirement to scale efficiently in today’s fast paced marketplace. Contact MRSI Systems to learn how MRSI can help your company scale.
Symposium Highlights
The highlights of this year’s IMAPS Symposium are keynote presentations on the following topics-
- Packaging Challenges for the Next Generation of Mobile Devices
- Packaging without the Package – A More Holistic Moore’s Law
- Electronics Outside the Box: Building a Manufacturing Ecosystem for Flexible Hybrid Electronics
- Transforming Electronic Interconnect
Read the IMAPS 2017 Program for more details.
Please contact MRSI Systems to learn about our die bonders and epoxy die attach solutions. We hope to see you at the exhibition in Raleigh. If you are unable to attend the exhibition please contact us to schedule a meeting at MRSI factory in Billerica, MA.