International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2018

MRSI Systems Sponsors IMAPS

MRSI Systems has been a member and proud supporter of IMAPS for more than 30 years and is pleased to sponsor the exhibit lunch at the 2018 IMAPS Symposium. Stop by the MRSI Systems’ Booth (#423) to learn about our new die bonding family for high volume manufacturing and our epoxy die bonding solutions. Learn more about IMAPS Pasadena 2018.

2018 IMAPS Symposium Keynote Presentations

The highlights of this year’s IMAPS Symposium are presentations on the following topics-

• Challenges and Potential Solutions in Heterogeneous Integration from a Foundry Viewpoint
• Accelerating the Digital Transformation – An Ecosystem View
• AI Hardware: Packaging to the Core!
• Emerging Technologies: Electronic Packaging for 5G Microwave and Millimeter Wave Systems
• Reliability: A Methodology for Understanding the Reliability of Electronic Packaging

See IMAPS 2018 Technical Program for more details.

Why MRSI Systems?

Many of MRSI’s long-standing customers are Microwave & RF leading component manufacturers. From Transmitter and Receiver Modules to Power Amplifiers, MRSI has been the platform of choice for these manufacturers. MRSI Systems leadership in eutectic bonding solutions for the Microwave & RF industries and in particular devices such as high-power amplifiers is based on several key outcomes required from customers.

Firstly, manufacturers require a very reliable means of attachment for these devices, secondly, a high degree of precision is essential, thirdly they require any system to handle a wide variety of pickup tools, collets, and parts and finally to achieve the necessary volumes, these die bonding systems need to be fully automated.

Automation: To automate this process, the package or substrate must be presented on or moved to a surface that can be thermally controlled.  The die bonder moves the solder preform and die to the substrate and ramps the temperature to achieve reflow.  Ideally, temperature ramp is performed quickly for throughput and quality issues.  The process must occur in an inert environment to avoid oxidation.  Good coverage is obtained (no voiding) when the system can be programmed to scrub the die into the molten solder.

Reliability and Precision:  Leading manufacturers of high-frequency radio modules require fully automated, ultra-precision die bonding systems with in-situ capabilities such as epoxy dispensing and eutectic die bonding. Advanced imaging techniques using pattern recognition are needed to orient components. Force control during the picking and placement operations is a must.

A requirement may exist to align a die to a feature in one axis, such as a die edge to a substrate edge, while also aligning to another feature in another axis, such as a die bond pad to a substrate bond pad.  This is known as ‘split alignments’ and is required for some microwave and photonic applications.

In advanced packaging applications die need to be placed with a high degree of precision.  Frequently for performance purposes, the die must be placed with a particular accuracy relative to other devices, fiducials, or features.  MRSI’s die bonders are designed to handle a wide range of processes. Epoxy dispensing pumps, epoxy stamping and eutectic bonding with scrub and temperature control, are all configuration options that make MRSI’s die bonders the leading solution for MEMS device assembly.

Schedule a meeting with MRSI Systems at IMAPS Pasadena to learn more about MRSI Systems’ die bonders and epoxy die bonding solutions and how their family of products can help you scale your manufacturing environment. MRSI Systems has been serving optoelectronic and microelectronic customers for the past thirty-three years and understands their requirement to scale efficiently in today’s fast-paced marketplace.

We look forward to seeing you at the exhibition in Pasadena. If you are unable to attend the exhibition, please contact us to schedule a meeting at MRSI factory in Billerica, MA.

Contact MRSI Systems to learn about our die bonding and epoxy die attach solutions.