Interview with MRSI: Accuracy is improved to 1.5 microns to meet the 5G and 400G high-speed interconnection era of optical device automated placement solution system
During the summer, China Fiber Optics Online (CFOL), interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Mycronic to discuss MRSI’s latest product development and some of the key trends in the industry. Below we have captured some of the takeaways from the discussion.
Figure. (From Left) MRSI Service Engineer Jianxi Liu, CFOL Principle Analyst Ria Tang, MRSI Senior Director of Strategic Marketing Dr. Limin Zhou
CFOL: As reported, in recent years, the rapid development of the Internet, and the advent of the era of 5G are major trends forcing many companies to consider the best strategic approach to supporting their customers. Specifically, a variety of new applications have higher performance requirements for the optical network. The new trend is driving new optical device requirements, including, high speed, high density, and miniaturization. This brings new challenges for the assembly process and equipment. How is MRSI approaching these challenges?
LZ: MRSI, is a global leader in fully automated high precision assembly equipment, and we regard these new challenges as an opportunity to continue to support our customers and launch innovative new products. Our recent addition to our family of products, is a 1.5 micron die bonding system to address these performance requirements.
CFOL: What is the history of MRSI and what has been the product strategy to date?
LZ: Founded in 1984, MRSI Systems is a leading manufacturer of high-speed, high-precision, fully automated die bonding and dispensing systems. MRSI has been recognized as the industry standard, providing to the world’s leading photonics and microelectronics customers “one-stop-shop” solutions from R&D, NPI to mid volume or mass production for laser, detector, modulator, AOC, WDM/EML TO-Can, Optical transceiver module, LiDAR, VR/AR, sensor and optical imaging products. With more than 30 years of industry experience and the local technical support teams around the world, MRSI provides the most effective system and assembly solutions for all levels of packaging, including Chip-on-Wafer (CoW), Chip-on-Submount (CoS), PCB and box packaging. More recently we were the first to introduce a 1.5 micron precision, high speed, and high flexibility die bonder.
CFOL: Could you describe in more detail how you see these trends impacting optical device manufacturers and how MRSI is meeting these challenges?
LZ: With the advent of 5G, the optical network infrastructure is the key to the optical interconnection. It needs a higher level of performance from 25G/50G/100G/200G/400G optical devices/modules for 5G fronthaul, backhaul, and the new generation of data centers. Higher speed, higher density, smaller size, and lower power consumption are all essential requirements for these new integrated optical devices. The assembly process and equipment to support the manufacturing of these new devices becomes the challenge. Based on these market requirements, MRSI launched the fully automated MRSI-H and MRSI-HVM 1.5 micron high-precision, high-speed and high-flexibility die bonders. The precision is doubled compared with the previous MRSI-H3 and MRSI-HVM3 3 micron machines, and the high flexibility characteristics are maintained, which can meet the requirements of miniaturization and higher density of high-hybrid integrated devices.
Specifically, the newly upgraded 1.5 micron die bonders have met the urgent needs to enable mass production of the key components such as high-speed DFB/WDM/EML TO-can, TOSA/ROSA, 400G/800G, 5G RF. It not only achieves the 1.5 micron precision required, but it also achieves the fastest speeds in the industry. The machine’s high flexibility enables device manufacturers to respond rapidly to market changes and continually iterate new product development. The machines have two configurations either a single-head or a dual-head configuration, as well as heated-head configurations suitable for the high-density multi-chip eutectic, and it also has TO-CAN configurations for high-precision complex TO-CAN, to ensure a variety of customer requirements for different product lines
Technology is always evolving, and we have witnessed the rapid development of optical communication solutions, from the earliest 7 to 10 microns die bonders, to the current less than 3 micron die bonders, then to a new generation of 1.5 micron die bonders. MRSI has been committed to developing advanced assembly equipment to support the photonics industry for decades. We also have seen China’s optical device manufacturers continue to invest in the technology required to succeed in the ever changing advanced photonics industry.
CFOL: Have these new trends and requirements changed the way customers think about solutions?
LZ: Despite the rapid developments driving the market, customers are still trying to optimize their key process requirements such as yield, production capacity, and time to market. Our role for over 30 years has always been to constantly strive to improve our customer’s performance by launching products at the right time with the most relevant value. This has required significant R&D investment.
CFOL: Can customers see the new systems in China?
LZ: MRSI has a 1.5 micron demo machine in the Mycronic demo center located at Lv Chuang Yun Gu Building, Nanshan, Shenzhen, supported by professional technical application engineers. We encourage photonics device enterprises to bring their materials and visit the demo center for an on-site free demo. Customers appreciate the benefits of seeing our features of high accuracy, high efficiency die bonders, in person and discussing their specific application needs.
About MRSI SYSTEMS
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high- volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com