MRSI-H1: Comprehensive High-Precision Die Bonding Solutions
In the fast-paced world of photonics manufacturing, having the right tools can make all the difference. The MRSI-H1 is designed to meet the demands of high-volume production with its ultra-precision 1-micron flip-chip die bonders. These machines are not only flexible and fast, but also ideal for a wide range of applications.
Key Features and Benefits
The MRSI-H1 die bonders are engineered for versatility and speed. They are equipped with a gantry and bonding head that utilize air bearings and brushless DC linear motors with 50nm linear encoders. This ensures high precision and repeatability, with placement accuracy of less than ±1μm at 3σ.
One of the standout features of the MRSI-H1 is its ability to handle various bonding processes, including eutectic bonding, epoxy stamping, UV epoxy dispensing, and flip-chip bonding. The machines are designed to accommodate different chip sizes, starting from as small as 140μm.
Applications
The MRSI-H1 die bonders are suitable for a wide range of applications, including chip-on-carrier (CoC), chip-on-submount (CoS), and chip-on-baseplate or board (CoB). They are also ideal for high-density top heating eutectic bonding, silicon photonics, heterogeneous integration, and multi-chip multi-process production in one machine.
Conclusion
The MRSI-H1 series is a powerful and versatile solution for high-volume photonics manufacturing. With its high-precision, speed, and flexibility, it is designed to meet the demands of modern production environments. Whether your requirements involve intricate bonding processes or expedited production cycles, the MRSI-H1 die bonders are equipped to meet these demands efficiently.
Learn more about the MRSI-H1 die bonder family and how it can enhance your manufacturing processes.