MRSI is Presenting at ICCSZ OC Market and Technology Seminar and Offering Die Bonder Demonstrations at CIOE
MRSI Systems and CYCAD Century Science and Technology will partner at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86. The show will be held at the Shenzhen Convention and Exhibition Center from September 4-7, 2019.
MRSI Systems will also attend the 18th ICCSZ OC Market and Technology Seminar. This event is organized by Infostone Communication Consultant (ICCSZ) in Shenzhen, China, from September 2-3, 2019. Dr. Yi Qian, Vice President of Marketing, MRSI Systems, will be presenting “Progress in Assembly Automations: Volume Manufacturing of Photonics Devices in Data Center and 5G Era.”
CIOE is the world’s most influential optoelectronic exhibition and encompasses the full optoelectronic supply chain. Featured topics include data centers, optical communications, optical manufacturing, AR/VR, LiDAR, and automotive and laser technologies. Exhibitors will be attending from several industries, such as: optical communication, consumer electronics, advanced manufacturing, defense and security, semiconductor processing, sensing and measurement, lighting, and medical.
MRSI Improves Accuracy for MRSI-H/HVM-Series Die Bonders
At CIOE’17, MRSI introduced their H-series product line, the most flexible, high-speed, high-precision die bonders. This series is driven by 40/100/200/400/800G technology evolutions, data centers, and 5G wireless applications. MRSI has since installed dozens of these systems worldwide.
MRSI recently announced the latest advancement in the MRSI-H/HVM-series product line. Placement accuracy was tested using industry-standard glass die reference samples. Results showed enhancement from ±3 micrometers at 3 sigma, to ±1.5 micrometers at 3 sigma. Moving forward for shipment starting from October 1, 2019, the product names will be MRSI-H and MRSI-HVM (formerly known as MRSI-H3 and MRSI-HVM3). For more on these changes, view the recent press release.
Targeted configurations for the MRSI-H product family include WDM & EML-TO and high-power laser diode packaging. The MRSI-HVM family has extended configurations which target AOC applications. These options include inline automatic conveyorized loading/unloading, epoxy dispensing, stamping, and UV curing capability. These are critical components for newer applications such as 400G transceivers and silicon photonics.
Find out what MRSI products can offer you. Witness a demo of our ultra-fast die bonder at CIOE, presented by our partner CYCAD located at Booth #1C86. Make sure to pick up your copy of the Visitor Guide at CIOE. You can also visit our website or contact us to schedule a meeting.