MRSI Systems – IEEE Tech Insider Webinar: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications
Internet traffic has been growing at an exponential level, continuously driven by video streaming, 3D imaging, IoT, VR/AR, and other emerging data applications. The data generated by internet traffic is enormous and data centers are crucial to support data communications, storage and processing through cloud computing. Photonic devices such as optical transceivers play vital roles in modern data centers. Demand for photonic devices is at an unprecedented level. And the technology upgrades to support this demand are expected to happen at the same time as this volume ramps, e.g. 40G to 100G and to 200G/400G and beyond.
These requirements have posed significant challenges to photonic device manufacturing. To support data center build-up, the photonic device companies need to maintain an “elastic capacity model” to respond fast to data center customer’s demands, and at the same time to maintain low manufacturing costs to produce profits. This calls for much higher levels of manufacturing automation than the photonic industry has ever experienced. In addition, the co-existence of many product standards requires that manufacturing automation is flexible to allow multiple products, e.g., single die Fabry-Perot (FP) laser submount and multiple die electro-absorption laser (EML) submount assembly, to go through the same production lines without sacrificing throughput. Furthermore, more and more advanced technologies demand higher and higher precision in assembly automations, again without sacrificing speed and throughput. High speed, high precision, and high flexibility for the high volume manufacturing of photonic devices require closer collaboration than ever between device designers, process developers, manufacturing engineers, and automation equipment suppliers. This webinar will discuss these trends, challenges, and opportunities.
Please join us for the IEEE Spectrum Tech Insider Webinar
Title: Tech Insider Webinar: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications
Date & Time: Thursday, January 25, 2018 at 11:00 AM EST.
Speaker: Dr. Yi Qian, Vice President of Product Management, MRSI Systems
Dr. Qian joined MRSI Systems in 2015 to help develop the company’s market strategy and product roadmaps, drive the development of new products, and diversify MRSI product offerings to target higher growth market segments. He has over 20 years of experience in large corporations and small start-up companies, developing and marketing advanced optoelectronic and mechanical components and systems with integrated hardware and software, for fiber optics / photonics, sensors, medical devices and other industries.
Prior to MRSI Systems he was Director of Product Management and Marketing at Cambridge Technology, a Novanta company, delivering high performance laser scanners for multiple industries. Before that, Dr. Qian worked at Oclaro as Director of Product Management for 40G/100G optical transceivers and line cards. He was Vice President of Engineering in Dimensional Photonics International, a 3D laser sensor system startup that was acquired by Danaher Dental. Prior to that he was Director of Engineering making high speed and high power semiconductor laser diodes and modules in Corning’s Lasertron division. He started his career in industry at Lasertron Inc before Corning’s acquisition.
Dr. Qian received a Bachelor’s Degree in Electrical Engineering from Zhejiang University and a Ph.D. Degree in Physics from Institute of Semiconductors, Chinese Academy of Sciences. He was also a postdoctoral researcher at Cornell University focusing on wafer-bonded long wavelength VCSELs, new compliant substrate structures and materials, and advanced nanofabrication technologies. He holds 10 issued and pending patents and has published more than 45 articles in the areas of nano-Silicon, high power and high speed lasers, and 3D optical sensing systems.
About MRSI Systems
MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonding and epoxy dispensing systems. We enable customers to optimize the performance of their process including yield, throughput, and uptime by building systems that use our unique expertise. In summary, this includes our proprietary software, proven hardware, deep process knowledge, state-of-the-art manufacturing, and a world-class customer service team. MRSI’s systems are built on common platforms that can be configured to meet specific customer requirements. These platforms are designed to be scalable for R&D prototyping, pilot production and high volume manufacturing. Our solutions deliver the best financial returns in the industry while integrating seamlessly into our customer’s production. Markets include Telecom/Datacom (Data Center), Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial. Since 1984, we have been recognized as the standard of the industry, delivering our solutions to leading optoelectronic and microelectronic customers worldwide. We are headquartered in Billerica, MA in the greater Boston area. Our sales are supported by a global network of direct service and support professionals, located in China, Taiwan, Singapore, Korea, Thailand, Malaysia, the Philippines, Israel, Europe, United Kingdom, and the United States.