MRSI Systems (Mycronic Group) delivered a keynote speech at the 2022 CFOL Optical Interconnection Conference and MRSI-H-HPLD+ 1.5 micron Die Bonder won the Award for “2022 CFOL Product Innovation”

In his speech, Dr. Zhou introduced the photonics chip from information perception to transmission, as well as information storage and processing in the field of optical interconnection, including the rapid development of high-speed optical transceivers, vehicle laser radar, photonics computing and other applications in the market. In his speech, he analyzed the technological innovation and the expansion of demand for vehicle-mounted laser radar, high-speed optical communication and other new optoelectronic devices emerge one after another, new devices require smaller volume, more integrated packages to achieve lower cost and power consumption. The general trend of photonics chip assembly is to require packaging equipment with higher reliability, higher accuracy, higher speed or machine efficiency, and ultra-high process flexibility in order to obtain the best ROI. Dr. Zhou demonstrated the international industry-leading equipment developed by MRSI for different applications, as well as the industry-leading process results by using a large number of true examples.  

Finally, Dr. Zhou shared the latest model MRSI-H-HPLD+, which has just been launched by MRSI (Mycronic Group). The H series products have been widely proven and have excellent flexibility to achieve the high-volume production of true multi-chip, multi-process, multi-variety optoelectronic devices on a single machine. MRSI-H-HPLD+ systems are equipped with manipulator auxiliary loader, which improves the working efficiency of single head machine by more than 30%. Combined with advanced parallel processing, industry-leading speeds are achieved while maintaining machine flexibility, accuracy and reliability. By deploying the H series systems in production lines, customers can flexibly and quickly complete the replacement of new products according to current production requirements without adding other equipment. Its patented modular design occupies a high market share in many high-growth market segments and is regarded as the benchmark of high-precision die bonding machines by industry peers. MRSI-H-HPLD+ is designed to meet the manufacturing challenges brought by the promotion of 5G wireless networks and the growth of the high-power semiconductor laser market, as well as the mass production of vehicle laser radar. The MRSI-H-HPLD+ delivers an attractive return on investment for optoelectronics and microelectronics device manufacturing customers.  

“MRSI’s die bonders have been widely used over many years by high power laser manufacturers. This new HPLD+ version takes the performance to the next level. This new product continues with our proven track record of providing a combination of ultra-precision, high-speed, and high-flexibility. This is critical for our customers’ high-mix high-volume flexible manufacturing,” said Dr. Yi Qian, Mycronic Group’s Vice President and General Manager for MRSI Systems.

Award winning MRSI-H-HPLD+ 1.5 micron Die Bonder 

From July 6 to 8, 2022, the three-day 2022 CFOL Optical Interconnection Conference was held in Huashan Hotel, Nanjing, with the theme of “Connecting all Things with Light and colorful Future”, attracting more than 800 enterprises from the whole optical communication industry chain and more than 1300 people attended. MRSI (Mycronic Group) won the 2022 Innovation Product Award (Manufacturing Equipment category) for its MRSI-H-HPLD+ 1.5-micron die bonder machine series products. The award aims to recognize product leadership, or breakthroughs in key indicators, process innovation, and calls on outstanding companies to play an exemplary role  to promote the healthy and sustainable development of the industry. 

The 3rd CFOL “2022 Annual Product Innovation Award” focuses on evaluating the influence of representative optical communication products in the industry, based on product sales (market share), leading technology or innovation ability (next-generation leader), and brand awareness (media promotion). Customers, suppliers, industry end users, CFOL review experts and market analysts of the shortlisted companies are invited to jointly score the key points. In recognition of the leadership or breakthroughs in key indicators, process innovation, the conference collected 100 “innovative products,” of which 51 new products were shortlisted, and finally 17 products won the “2022 Product Innovation Award.”  Only two in the manufacturing equipment category won this award.